智能卡芯片产品失效分析样品制备技术  

Sample preparation technology for failure analysis of smart card chip products

作　　者：董媛 DONG Yuan(CEC Huada Electronic Design Co.,Ltd.Beijing Key Laboratory of RFID Chip Test Technology)

机构地区：[1]北京中电华大电子设计有限责任公司射频识别芯片检测技术北京市重点实验室

出　　处：《中国集成电路》2022年第11期68-70,共3页China lntegrated Circuit

摘　　要：以智能卡芯片产品为例,介绍了四类失效分析样品制备技术,可用于指导失效分析制样种类选取和制样方法选取,能够满足大部分的失效分析制样需求。Based on the failure analysis technology of smart card chip products,four types of failure analysis sample preparation techniques were introduced,which can be used to guide the selection of sample preparation types and sample preparation methods for failure analysis,and can meet most of the failure analysis sample preparation requirements.

关 键 词：失效分析技术 样品制备 

分 类 号：TN407[电子电信—微电子学与固体电子学]