XPS测试下不同温度对高温粘结剂粘接界面化学结构变化研究  

Study on the change of chemical structure of high temperatureadhesive interface at different temperatures under XPS test

作　　者：王辉[1] WANG Hui(Xi'an Peihua University,Xi'an 710125,China)

机构地区：[1]西安培华学院,陕西西安710125

出　　处：《粘接》2022年第11期16-19,共4页Adhesion

摘　　要：以酚醛树脂等材料为主要实验原材料,在X射线光电子能谱(XPS)测试方法环境下针对实验材料所制备的粘结剂对碳材料的粘接性能进行分析。结果表明:酚醛树脂、碳化硼等原材料制备而成的粘结剂在XPS条件下所形成的粘接胶层为无定形碳状态形成的类似骨架的立体结构,随着测试环境温度的提升,酚醛树脂等材料制备的粘结剂有序化程度会逐步提高,粘结剂在粘接界面表现出相容性逐渐提升的变化态势;同时粘结剂粘接界面上会逐渐形成一层B_(2)O_(3),实现了化学键合连接。In this paper,the carbon bonding properties of adhesives prepared by the experimental materials such as phenolic resin were analyzed using X-ray photoelectron spectroscopy(XPS).The experiment results show that the adhesive layer formed by phenolic resin,boron carbide and other raw materials under the condition of XPS is a three-dimensional structure similar to the skeleton formed in the amorphous carbon state.With the increase of the test ambient temperature,the degree of ordering of the adhesive prepared by phenolic resin and other materials will gradually improve and the compatibility of the adhesive at the bonding interface will gradually increase.At the same time,a layer of B _(2)O_(3) will be formed on the interface of the adhesive,which realizes the chemical bonding.

关 键 词：XPS测试 高温粘结剂 化学结构 

分 类 号：TQ437[化学工程] TQ174.1