一种提升玻纤布覆铜板相比漏电起痕指数的方法  

A method of improving the CTI index of glass fiber Copper Clad Laminate

作　　者：张友梅 刘玲 邱银 施忠仁 王顺程 Zhang Youmei;Liu Ling;Qiu Yin;Shi Zhongren;Wang Shuncheng(CHONGQING DEKAI INDUSTRY CO.,LTD.)

机构地区：[1]重庆德凯实业股份有限公司,重庆405400

出　　处：《印制电路信息》2022年第11期13-15,共3页Printed Circuit Information

摘　　要：固体绝缘材料表面在电场与电解液的联合作用下逐渐形成导电通路的过程称为相比漏电起痕指数。而绝缘材料表面抗漏电起痕的能力,即为耐漏电起痕。提升表面相比漏电起痕指数(CTI)的能力是一种节省成本的方法。文章使用两种特种胶——碳氢类胶膜与铁氟龙(PFA)膜与覆铜板(FR-4)进行压合实验,结果显示两者均能提升覆铜板CTI>700 V。The process of forming conductive path on the surface of solid insulating material due to the combined action of electric field and electrolyte is called electric leakage.The ability of the surface of the insulating material to resist electric leakage is the resistance to electric leakage.It is a cost-effective method to improve the ability of the surface to resist electric leakage.In this paper,two kinds of special adhesives-hydrocarbon adhesive film and Teflon(PFA)film and copper clad laminate(FR4)were used to carry out in experiments.The results show that both of them can improve the resistance of copper clad laminate products to leakage and its CTI>700.

关 键 词：相比漏电起痕指数 玻纤布基板 薄膜 

分 类 号：TN41[电子电信—微电子学与固体电子学]