减成法工艺下非电镀线路的精准加工方法  

Non-plated line precision and accuracy improvement by subtractive process

作　　者：王星星 Wang Xingxing

机构地区：[1]深南电路股份有限公司,广东深圳518117

出　　处：《印制电路信息》2022年第11期26-32,共7页Printed Circuit Information

摘　　要：对于非电镀层线路而言,线宽精度是影响阻抗精度的关键因素。文章以标称铜厚18μm的覆铜板为例,阐述了减成法工艺下各个制程对线宽精度产生的影响。通过制程上和设计上的双重优化改善,将线宽的过程能力指数(Cpk)在±5μm的公差下由改善前的0.46提升到1.06(潜在合格率99.9%),为非电镀层阻抗精度的提升奠定了基础。For the non-plated line of PCB,the linewidth accuracy is the key factor affecting the impedance accuracy.Taking the CCL with nominal copper thickness 18μm as an example,this work expounds the influence of each process on the linewidth accuracy with the subtractive process.Through the double optimization and improvement of the process and design,the Cpk of the linewidth with the tolerance of±5μm is increased from 0.46 to 1.06,which lays a foundation for the improvement of impedance accuracy of non-plated layer.

关 键 词：高精准度线路加工 过程能力指数 非电镀层线路 

分 类 号：TN41[电子电信—微电子学与固体电子学]