中空玻璃微珠/氮化硼填充硅橡胶复合材料的介电、导热和阻燃性能研究  

Dielectric,thermal conductivity and flame retardant properties of hollow glass microspheres/boron nitride filled silicone rubber composites

作　　者：吴航 邱水来 宋磊[1] 胡源[1] WU Hang;QIU Shuilai;SONG Lei;HU Yuan(State Key Laboratory of Fire Science,University of Science and Technology of China,Hefei 230026,China)

机构地区：[1]中国科学技术大学火灾科学国家重点实验室,合肥230026

出　　处：《火灾科学》2022年第2期76-84,共9页Fire Safety Science

基　　金：安徽省自然科学基金(2108085QE211);中国博士后科学基金(2020M671905)。

摘　　要：为满足5G电子封装材料的性能需求,将一定量的改性中空玻璃微珠(f-HGM)和氮化硼(f-BN)添加进加成型液体硅橡胶中制备了低介电、高导热且阻燃的硅橡胶复合材料。测试结果表明,添加了10份f-HGM和15份f-BN的复合材料的介电常数为2.68,介电损耗为0.008 16,显著低于纯硅橡胶,热导率为0.518 W/m·K,是纯硅橡胶的2.25倍。此外,复合材料的热稳定性得到了提升,pHRR和THR分别下降了55.3%和37.7%。通过气相和凝聚相分析发现,复合材料的气相热解产物浓度大幅降低,残炭的致密性和连续性得到显著提升。To meet the performance requirements of 5 G electronic packaging material,a certain amount of functionalized hollow glass microspheres(f-HGM) and boron nitride(f-BN) were added into the addition-cure liquid silicone rubber to prepare flame retardant silicone rubber composites with low dielectric constant and high thermal conductivity.The test results showed that the dielectric constant and loss of SR/f-HGM10/f-BN15 composite were 2.68 and 0.008 16,respectively,which were significantly lower than those of pure silicone rubber,and the thermal conductivity of the composite was 0.518 W/m K,which was 2.25 times as high as pure silicone rubber.In addition,the thermal stability of the composite was improved,and the pHRR and THR values decreased by 55.3% and 37.7%,respectively.The gas and condensed phase analysis results showed that the gaseous pyrolysis products of the composite were greatly reduced,and the compactness and continuity of the carbon residue were significantly improved.

关 键 词：硅橡胶 介电 导热 热稳定性 阻燃 

分 类 号：X932[环境科学与工程—安全科学]