Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO_(2):Microstructure and mechanical properties  

作　　者：Fupeng Huo Zhi Jin Duy Le Han Jiahui Li Keke Zhang Hiroshi Nishikawa 

机构地区：[1]Joining and Welding Research Institute,Osaka University,Ibaraki,Osaka 565-0047,Japan [2]Graduate School of Engineering,Osaka University,Suita,Osaka 565-0871,Japan [3]School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China [4]Department of Welding Engineering and Metals Technology,School of Mechanical Engineering,Hanoi University of Science and Technology,No.1 Dai Co Viet,Hai Ba Trung,Hanoi,Viet Nam

出　　处：《Journal of Materials Science & Technology》2022年第30期157-170,共14页材料科学技术（英文版）

基　　金：supported by the China Scholarship Council(No.202008050209)。

摘　　要：With the trends of miniaturization and high density of electronic packaging,there has been an urgent demand to open up lead-free solders with high strength and ductility.In this study,a ZrO_(2)-reinforced Sn1.0Ag0.5Cu composite solder was designed.First,surface modification on ZrO_(2) was conducted with ball milling-pyrolysis method.Subsequently,NiO modified ZrO_(2)(NiO/ZrO_(2))was added to the solder matrix with ultrasonic stirring.The morphology and interface of NiO/ZrO_(2) were discussed.Moreover,the microstructure,interface and mechanical properties of the composite solders were systematically studied.The results showed that NiO nanoparticles were evenly adhered to the ZrO_(2) surface,and the interface relationship between them was semi-coherent and coherent.Further,an appropriate addition of NiO/ZrO_(2) could refine the microstructure of composite solders.The refinement mechanism was systematically investigated.Besides,a micro-mechanical lock and non-micropored clean interface was formed between NiO/ZrO_(2) and the solder matrix.The Sn/NiO/ZrO_(2) interface system based on mutual solid solution was ingeniously designed.The ultimate tensile strength and elongation were increased synergistically,and the fracture mechanism transformed from a ductile−brittle mixed fracture mode to a ductile fracture mode.Therefore,a lead-free solder with high strength and ductility was obtained.

关 键 词：SnAgCu composite solder ZrO_(2)nanoparticles Refinement mechanism Surface modification INTERFACE REINFORCEMENTS 

分 类 号：TG425[金属学及工艺—焊接]