自循环微冷却系统的设计与测试  

Design and Test of Self-circulating Micro-cooling System

作　　者：王锐[1] 魏涛[1] 黄豪杰 钱吉裕[1] 谢迪 WANG Rui;WEI Tao;HUANG Haojie;QIAN Jiyu;XIE Di(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)

机构地区：[1]南京电子技术研究所,南京210039

出　　处：《现代雷达》2022年第9期104-107,共4页Modern Radar

摘　　要：随着高热耗高集成功率器件要求的提高,高效散热技术与微系统冷却的研究在不断推进。目前的微系统散热存在微细流道容杂质能力差、末端换热器体积大、系统散热效率低等问题。文中设计搭建了自循环冷却构架,研制出集成散热基板、微泵、微换热器的自循环微冷却系统原理样机,测试结果表明,该样机最高可实现热流密度500 W/cm~2的芯片冷却。With the improved requirements of high concentration for power devices,the research of high-efficiency cooling technology and microsystem cooling is advancing.The current microsystem cooling has problems of poor tolerance impurity ability in microflow channel,a large volume in final-stage heat exchanger,and low heat dissipation efficiency in system.A self-circulating cooling structure is designed and established.A prototype of the self-circulating micro-cooling system of integrated heat sink,micropump,and microheat exchanger is developed.The test results show that the chip cooling of 500 W/cm~2 can be achieved.

关 键 词：散热 芯片 自循环 微流道 

分 类 号：TK124[动力工程及工程热物理—工程热物理]