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作 者:徐向鹏 蔡艳青 陈兴刚 许莹 XU Xiang-peng;CAI Yan-qing;CHEN Xing-gang;XU Ying(School of Materials Science and Engineering,North China University of Science and Technology,Key Laboratory of Inorganic Nonmetallic Materials of Hebei Province,Tangshan Hebei 063210,China)
机构地区:[1]华北理工大学材料科学与工程学院,河北省无机非金属材料重点实验室,河北唐山063210
出 处:《华北理工大学学报(自然科学版)》2023年第1期50-57,共8页Journal of North China University of Science and Technology:Natural Science Edition
基 金:国家级大学生创新创业计划项目(X2021028)。
摘 要:钴铬合金具有良好的耐磨性、耐菌性及生物性能,是理想的医用金属材料,但钴铬合金对细菌的粘附往往比较敏感,容易引发口腔细菌感染,因而采用化学镀方法在钴铬合金上镀铜,对镀铜工艺参数进行单因素变量研究,得出化学镀铜最佳实验方案为:硫酸铜质量浓度为16 g/L,酒石酸钾钠质量浓度为46 g/L,NaOH质量浓度为15 g/L,甲醛为15 g/L,pH为12.9。通过采用XRD分析和SEM表征结果表明,化学镀铜后表面化学成分大部分为Cu,且分布密集,厚度约为6~7μm。涂层和基体结合稳定,不易脱落,镀铜后的钴铬合金抗菌性能明显得到提高。Cobalt chromium alloy has good wear resistance,bacteria resistance and biological properties,it is an ideal medical metal materials,but cobalt chromium alloy of bacterial adhesion tends to be more sensitive,easy to oral bacteria infection.The method of electroless plating was used on the surface of cobalt chromium alloy for copper plating,and the copper plating process parameters on the single factor variable were studied.The optimal experimental plan for chemical copper plating as follows:The mass concentration of copper sulfate is 16 g/L,potassium sodium tartrate is 46 g/L,NaOH is 15 g/L,formaldehyde is 15 g/L,and pH is 12.9.The results of XRD analysis and SEM characterization show that the surface chemical composition of electroless copper plating is mostly Cu,and its thickness is about 6~7μm.The coating is stable in combination with the substrate and is not easy to fall off.The antibacterial performance of cobalt-chromium alloy after copper plating is improved obviously.
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