填充复合型聚合物基电磁屏蔽材料研究进展  

Research Progress of Filled Compound Polymer-based Electromagnetic Interference Shielding Materials

作　　者：王在铎 马晶晶 王方颉[2] 赵一搏[2] 赵建设[2] WANG Zaiduo;MA Jingjing;WANG Fangjie;ZHAO Yibo;ZHAO Jianshe(First Military Representative Office in Beijing Area for Naval Equipment Department,Beijing 100076;Aerospace Research Institute of Materials&Processing Technology,Beijing 100076)

机构地区：[1]海装驻北京地区第一军事代表室,北京100076 [2]航天材料及工艺研究所,北京100076

出　　处：《宇航材料工艺》2022年第5期1-7,共7页Aerospace Materials & Technology

摘　　要：综述了近年来填充复合型聚合物基电磁屏蔽材料的国内外最新研究进展,按照填料结构形态(纳微粒子颗粒型填料、高长径比结构填料、片层结构填料、三维网状框架结构填料),对相关复合材料电磁屏蔽性能数据进行统计和对比。围绕构筑高效导电网络的目标,从导电填料选择与处理、基体结构设计与制备方法等角度对聚合物基电磁屏蔽材料进行详细分析与总结,阐明了聚合物基电磁屏蔽材料研究现状及关键问题,阐述了聚合物基电磁屏蔽材料的研究方向和未来发展趋势。This review summarizes the recent reports on filled compound polymer-based electromagnetic shielding(EMI)materials. According to the fillers morphology(nanoparticle fillers,fillers with high aspect ratio structure,fillers with sheet structure,fillers with 3D network framework structure),the electromagnetic shielding performance data of related composites is compared and counted. Moreover,the fillers selection and treatment and the matrix structure design and preparation method are summarized and analyzed in detail based on the goal of building efficient conductive network. The key problems and research status are proposed,and the future development direction of filled compound polymer-based EMI materials is presented.

关 键 词：复合型聚合物 导电网络结构 屏蔽效能 介电损耗 吸收机制 

分 类 号：TQ328[化学工程—合成树脂塑料工业]