高导热石墨烯复合材料研究进展  

Research Progress of High Thermal Conductivity Graphene Composites

作　　者：葛瑛 杨东元 高超锋 韩洁 田小燕 高俊文 扈广法 卢红斌[1] GE Ying;YANG Dongyuan;GAO Chaofeng;HAN Jie;TIAN Xiaoyan;GAO Junwen;HU Guangfa;LU Hongbin(Department of Macromolecular Science,Fudan University,Shanghai 200438,China;College of Polymer Science and Engineering,Sichuan University,Chengdu 610065,China;School of Chemical Engineering and Technology,Xi’an Jiaotong University,Xi’an 710049,China;Shaanxi Yanchang Petroleum Group Co.,Ltd.,Xi’an 710065,China;Shaanxi Chemical Research Institute Co.,Ltd.,Xi’an 710054,China)

机构地区：[1]复旦大学高分子科学系,上海200438 [2]四川大学高分子科学与工程学院,成都610065 [3]西安交通大学化学工程与技术学院,西安710049 [4]陕西延长石油集团有限公司,西安710065 [5]陕西化工研究院有限公司,西安710054

出　　处：《上海塑料》2022年第5期1-7,共7页Shanghai Plastics

基　　金：石墨烯改性聚丙烯母粒量产技术研究(21563);石墨烯基高导热界面材料研发与应用(20-1-06);国家自然科学基金(22075048);上海国际合作研究项目(19520713900)。

摘　　要：电子器件、智能穿戴设备,以及处于高速发展期的新能源汽车都在朝着轻量化、高功率的方向发展,而散热问题已成为制约微电子和新能源行业发展的瓶颈性难题。石墨烯复合材料在热管理材料领域得到了广泛的关注与研究。综述了当前石墨烯导热复合材料的导热模型、三维石墨烯导热网络的构筑方法、石墨烯表面改性和石墨烯导热复合材料的制备方法。Electronic devices, intelligent wearable devices, and new energy vehicles in the high-speed development period are all developing towards the direction of lightweight and high power. The heat dissipation has become a bottleneck problem which restricts the development of microelectronics and new energy industries. Graphene composites have received extensive attention and research in the field of thermal management materials. The current thermal conductivity models of graphene thermal conductive composites, the construction methods of three-dimensional graphene thermal conductive networks, surface modification and the preparation methods of graphene thermal conductive composites are reviewed.

关 键 词：石墨烯 聚合物复合材料 导热模型 表面改性 

分 类 号：O613.71[理学—无机化学]