Signal and Power Integrity Challenges for High Density System-on-Package  

作　　者：Nathan Totorica Feng Li 

机构地区：[1]Department of Electrical and Computer Engineering,University of Idaho,Moscow,Idaho,83844,USA

出　　处：《Semiconductor Science and Information Devices》2022年第2期1-9,共9页半导体科学与信息器件（英文）

摘　　要：As the increasing desire for more compact,portable devices outpaces Moore’s law,innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself,as the case for system-on-package(SoP),has shown very promising results in overall size reduction and increased performance of electronic systems.With this ability to shrink electrical systems comes the many challenges of sustaining,let alone improving,reliability and performance.The fundamental signal,power,and thermal integrity issues are discussed in detail,along with published techniques from around the industry to mitigate these issues in SoP applications.

关 键 词：System on package(SoP) System in package(SiP) System on chip(SoC) Through silicon via(TSV) Signal integrity Power integrity Thermal integrity 

分 类 号：TN9[电子电信—信息与通信工程]