双导热网络功能化氮化硼纳米片/聚氨酯复合材料的制备与导热性能  

Preparation and thermally conductive properties of functionalized boron nitride nanosheets/polyurethane composites with double heat-conduction networks

作　　者：石林 马忠雷[2] 景佳瑶 向小莲 李桢 李运涛 SHI Lin;MA Zhonglei;JING Jiayao;XIANG Xiaolian;LI Zhen;LI Yuntao(College of Chemistry and Chemical Engineering,Shaanxi Key Laboratory of Chemical Additives for Industry,Shaanxi University of Science and Technology,Xi’an 710021,China;College of Chemistry and Chemical Engineering,Shaanxi Key Laboratory of Polymer Science and Technology,Northwestern Polytechnical University,Xi’an 710129,China)

机构地区：[1]陕西科技大学化学与化工学院,陕西省轻化工助剂重点实验室,西安710021 [2]西北工业大学化学与化工学院,陕西省高分子科学与技术重点实验室,西安710129

出　　处：《复合材料学报》2022年第10期4531-4539,共9页Acta Materiae Compositae Sinica

基　　金：国家自然科学基金(51903145);中央高校基本科研业务费专项资金(D5000210627)。

摘　　要：研发低填充且高导热的聚合物基导热复合材料是目前亟需解决的瓶颈问题。基于层层氢键组装,以聚氨酯(PU)开孔泡沫为模板,以聚多巴胺功能化改性氮化硼纳米片(BNNS@PDA)为导热填料,采用浸涂-热压成型法制得低填充、高导热BNNS@PDA/PU复合材料。深入研究了BNNS@PDA和BNNS@PDA/PU复合材料的微观结构、导热性能和热稳定性等。结果表明,通过聚多巴胺(PDA)对BNNS进行表面功能化改性能够使其良好地负载于PU开孔泡沫的三维骨架表面。通过热压成型形成以PU骨架为主要导热网络、以PU骨架表面包覆的BNNS@PDA为次级导热网络的高效双重三维导热网络结构,从而降低导热复合材料的界面热阻。当BNNS@PDA填充量为16.3wt%时,双导热网络BNNS@PDA/PU复合材料的热导率达到0.783 W/(m·K),与单导热网络PU的热导率(0.387 W/(m·K))相比提高了102.3%。The development of polymer-based thermally conductive composites with low filling and high thermally conductivity remains a bottleneck problem that needs to be solved. Based on the layer-by-layer hydrogen-bond assembly, the low filling and high thermally conductive BNNS@PDA/PU composites are prepared by the dip coatinghot pressing method, using the porous polyurethane(PU) foams as template, and polydopamine functionalized nitride boron nanosheets(BNNS@PDA) as thermally conductive fillers. The microstructures, thermal conductive properties and thermal stability of BNNS@PDA and BNNS@PDA/PU composites were investigated in detail. The results show that the surface functionalization of BNNS by PDA can make it coat well on the three-dimensional skeleton of porous PU foams. After hot pressing, the highly effective double heat-conduction networks with the PU skeleton as the main heat-conduction network and BNNS@PDA on the surface of PU skeleton as the secondary heatconduction network are constructed, leading to the decreased interfacial thermal resistance of the thermally conductive composites. When the filling amount of BNNS@PDA is 16.3wt%, the thermal conductivity of BNNS@PDA/PU composites with double heat-conduction networks reaches 0.783 W/(m·K), which is 102.3% higher than that of PU with single heat-conduction network(0.387 W/(m·K)).

关 键 词：导热复合材料 双导热网络 聚氨酯开孔泡沫 功能化氮化硼纳米片 聚多巴胺 

分 类 号：TB332[一般工业技术—材料科学与工程]