氧化膜对Sn粉颗粒熔化温度的影响  

Effect of Oxide Membrane on Melting of Sn Powder Particles and Properties of Cu-Sn Binde

作　　者：王兵 黎克楠 杜晓旭 李国伟 阳东林 冯后清 胡智勇 Wang Bing;Li Kenan;Du Xiaoxu;Li Guowei;Yang Donglin;Ma Houqing;Hu Zhiyong(Zhengzhou Research Institute for Abrasive&Grinding Co.,Ltd.,Zhengzhou Abrasive Tool Grinding Research Institute Co.,Ltd.,Zhengzhou Henan 450001;State Key Laboratory of Superhard Materials Abrasives,Zhengzhou Henan 450001;Huatian Technology(Xi'an)Co.,Ltd.,Xi'an Shaanxi 710000)

机构地区：[1]郑州磨料磨具磨削研究所有限公司,河南郑州450001 [2]超硬材料磨具国家重点实验室,河南郑州450001 [3]华天科技(西安)有限公司,陕西西安710000

出　　处：《山西冶金》2022年第7期12-15,共4页Shanxi Metallurgy

摘　　要：通过对比不同氧含量Sn粉在熔化过程中熔化峰值温度的差异,研究了Sn粉表面的氧化膜对Sn粉颗粒熔化峰值温度的影响。研究结果表明,Sn粉氧含量(质量分数)在达到3500×10-6之后,颗粒表面形成完整的氧化膜,继续氧化,Sn粉的氧含量也不会快速增加。This paper studies the effect of the oxide membrane on the surface of the Sn powder on the melting peak temperature of the Sn powder particles by comparing the differences in the melting peak temperature of the Sn powder.The results show that after the oxygen content of Sn powder reaches 3500×10-6,the particle surface forms a complete oxide membrane and continues oxidation,and the oxygen content of Sn powder does not increase rapidly.

关 键 词：Sn粉 氧含量 熔化峰值温度 Cu-Sn结合剂 

分 类 号：TG442.1[金属学及工艺—焊接]