武钢CSP结晶器铜板热裂纹成因及控制  

Cause analysis of surface crack of CSP mould copper plate in WISCO

作　　者：钱龙 王红军 许颖敏 王海峰 叶飞 QIAN Long;WANG Hongjun;XU Yingmin;WANG Haifeng;YE fei(Plant of Long Product,Wuhan Iron&Steel Co.,Ltd.,Wuhan 430080,Hubei,China)

机构地区：[1]武汉钢铁有限公司条材厂,湖北武汉430080

出　　处：《宝钢技术》2022年第5期61-68,共8页Baosteel Technology

摘　　要：从结晶器铜板的材质、工艺参数设定、结晶器冷却水质、钢水中微量元素四个方面,分析了武钢CSP结晶器铜板裂纹的影响因素,提出了改进结晶器材质、优化电磁制动、结晶器冷却水工艺参数、改进结晶器水质、打磨铜板渣线五条控制结晶器铜板产生热裂纹的措施。因铜板裂纹非计划更换结晶器的比例由原来的80%降低到了13.5%,漏钢率由0.26%降低到了0,铜板使用寿命由3.5万t提高到10万t。The factors affecting the crack of mould copper plate of CSP in WISCO were analyzed from four aspects:the material of mould copper plate,the setting of technological parameters,the quality of mould cooling water,and the trace elements in steel.Five control measures to prevent the crack of mould copper plate were put forward,such as improving mould material,optimizing EMBR and mould cooling water parameters,improving mould water quality and grinding copper slag line.The proportion of unplanned mold replacement due to copper plate crack has been reduced from 80%to 13.5%,the breakout rate has been reduced from 0.26%to 0,and the service life of copper plate has been increased from 35000 t to 100000 t.

关 键 词：CSP 结晶器 铜板 热裂纹 

分 类 号：TF777[冶金工程—钢铁冶金]