树脂传递模塑成型工艺复合材料孔隙表征和孔隙形成预测研究进展  

Research Progress of Void Characterization and Filling-induced Void Prediction of RTM-prepared Composites

作　　者：肖昌伟 李文晓[1] XIAO Changwei;LI Wenxiao(School of Aerospace Engineering and Applied Mechanics,Tongji University,Shanghai 200092,China)

机构地区：[1]同济大学航空航天与力学学院,上海200092

出　　处：《材料导报》2022年第23期240-246,共7页Materials Reports

基　　金：航空基金项目(2015ZF38007);中央高校基本科研业务费专项资金项目(22120180133)。

摘　　要：复合材料制造缺陷严重影响制品的力学性能,通过对缺陷形成规律的探究,可以有效降低缺陷形成,提高制品力学性能。孔隙在各类工艺中有着较高的形成概率,在树脂传递模塑成型(RTM)工艺中更是如此,孔隙也因此成为被研究最多的制造缺陷。本文从试验的角度介绍了RTM工艺中形成的孔隙的特征以及孔隙在线监测法、密度法、超声波法、显微镜法和显微CT法等孔隙表征手段,描述了RTM工艺孔隙的形成机理,并综述了充模过程中孔隙形成过程的数值模拟研究与应用现状,最后展望了RTM工艺复合材料孔隙预测的发展方向。The manufacturing defects of composites can seriously affect the mechanical properties of composites. By exploring the formation law of manufacturing defects, the formation of defects can be effectively reduced, then the mechanical properties of products can be improved. Due to the high formation probability in various processes, especially in the resin transfer molding(RTM) process, voids have been the most studied manufacturing defects. This paper briefly introduces the characteristics of void formed in the RTM process and research progress of techniques for void characterization such as online monitoring method, density method, ultrasonic method, microscope method and micro-CT method, then the void formation mechanism of RTM process is elaborated. The research progress of void formation process based on numerical simulation is summarized. Finally, the challenges and outlook of the numerical simulation on the void formation of the RTM process are outlined.

关 键 词：树脂传递模塑成型工艺 孔隙 试验研究 数值模拟 孔隙表征 

分 类 号：TB332[一般工业技术—材料科学与工程]