已封装风速计系统的系统级模型研究  

A System-Level Model of the Packaged Wind Sensor System

作　　者：陈蓓 CHEN Bei(School of Microelectronics and Control Engineering,Changzhou University,Changzhou 213164,China)

机构地区：[1]常州大学微电子与控制工程学院,江苏常州213164

出　　处：《常州大学学报（自然科学版）》2022年第6期75-83,共9页Journal of Changzhou University：Natural Science Edition

摘　　要：设计了一个风速计系统的系统级模型,该风速计系统由传感器芯片和控制电路构成。风速传感器包括1个中心温度传感器、4个加热条和4个测温传感器。文章提出的模型基于集总参数理论,将热流比拟为电流,电压比拟为温度,热传导过程中的热阻比拟为电路的电阻。利用这一系统级模型构建的系统级电路,可以同时进行传感器芯片的热学分析与控制电路的电学分析。测试在风洞中进行,实验结果与系统级模型具有良好的一致性,这一研究成果为风速计的实际应用提供了有价值的参考。A system-level model of the wind sensor system including the sensor chip and the conditioning circuit was proposed in this paper.The wind sensor was composed of a center temperature sensor,four heaters and four temperature sensors.The presented model was based on the theory of lumped parameters.An analogy was drawn between the heat flow and the electric current.Herein,the voltage is an analogy for the temperature,and the thermal resistance is the resistance in the thermal transfer like the resistance in the circuit.Further,the thermal analysis of the sensor chip and the electrical analysis of the conditioning circuit were developed in one system-level circuit by using the model.The test was performed in the wind tunnel.Experiment results presented here showed an agreement with the system-level model.The results presented here provided a valuable reference for the practical application of the wind sensor.

关 键 词：系统级模型 热电模型 热风速传感器 

分 类 号：TN4[电子电信—微电子学与固体电子学]