导电高分子铝电容器耐回流焊的影响因素研究  

Research on Influencing Factors of Reflow Soldering Resistance of Conductive High Polymer Aluminum Capacitor

作　　者：刘泳澎 LIU Yongpeng(Zhaoqing Beryl Electronic Technology Co.,Ltd.,Zhaoqing 526020,China)

机构地区：[1]肇庆绿宝石电子科技股份有限公司,广东肇庆526020

出　　处：《现代信息科技》2022年第22期50-52,共3页Modern Information Technology

摘　　要：文章采用正交实验设计方法,研究了化成液、化成电压、化成温度、化成时间、化成次数五种影响因素对导电高分子铝电容器电性能及耐回流焊的影响。实验结果表明,化成液、化成电压和化成次数三个因素对产品性能的影响较大。经化成工艺优化后,产品经过260℃高温回流焊后性能仍非常稳定,适用于新一代氮化镓快速充电器、新能源汽车、服务器、工业电源等要求较高的应用场景。This paper uses the orthogonal experimental design method to study the influence of five factors such as the formation solution,formation voltage,formation temperature,formation time and formation times,on the electrical properties and reflow soldering resistance of the conductive high polymer aluminum capacitors.The experimental results show that the three factors of formation solution,formation voltage and formation times have greater influence on product performance.After the optimization of the formation process,the performance of the product is still very stable after high temperature reflow soldering at 260°C,which is suitable for the application scenarios with higher requirements such as the gallium nitride fast chargers of new generation,new energy vehicles,servers,industrial power supplies and so on.

关 键 词：固态铝电容器 化成工艺 耐回流焊 漏电流 

分 类 号：TM535[电气工程—电器] TN605[电子电信—电路与系统]