硅微粉/聚酰亚胺纸基覆铜板的制备及其性能  

Preparation and Properties of Silicon Microsilica/Polyimide Paper-based Copper Clad Laminate

作　　者：金圣楠 马锐 朱瑞丰 胡爱林 郭帅 卢雪峰 龙柱 JIN Shengnan;MA Rui;ZHU Ruifeng;HU Ailin;GUO Shuai;LU Xuefeng;LONG Zhu(Functional Materials Laboratory of Short Fiber,School of Textile Science and Engineering,Jiangnan University,Wuxi 214122,China;Lianyungang Fiber New Material Research Institute Co.,Ltd.,Lianyungang 222002,China)

机构地区：[1]江南大学纺织科学与工程学院短纤维功能材料研究室,江苏无锡214122 [2]连云港纤维新材料研究院有限公司,江苏连云港222002

出　　处：《塑料工业》2022年第11期105-111,173,共8页China Plastics Industry

摘　　要：为了获得具有良好综合性能的纸基覆铜板,以聚酰亚胺(PI)短切纤维和对位芳纶浆粕为原料,硅微粉为填料制备的加填PI纸的纤维纸,采用PI树脂作为基体树脂,制备了加填PI纸基覆铜板,研究了硅微粉对于PI纤维纸力学性能的影响以及对于纸基覆铜板介电性能和热学性能的影响。结果表明,硅微粉的加入,虽然在一定程度上影响了覆铜板的介电性能,但是有利于改善PI纤维纸的力学性能,同时提高覆铜板的耐热性能,使得最终制备而成的纸基覆铜板具有良好的综合性能,其中介电常数D_(k)为3.36,介电损耗D_(f)介于0~0.02之间,热分解温度T_(d-5%)为511℃,热膨胀系数CTE为3.31μm/(m·℃)。In order to obtain a paper based copper-clad laminate with good comprehensive performance,polyimide fiber paper was prepared by using polyimide short-cut fibers and para-aramid pulps as raw materials and microsilica as filler,polyimide paper-based copper clad laminate was prepared by using polyimide resin as matrix resin,the effect of microsilica on the mechanical properties of polyimide fiber paper and on the dielectric and thermal properties of paper-based copper clad laminate was investigated.The results show that the addition of microsilica,although to a certain extent,affects the dielectric properties of the copper clad laminate,but it is helpful for improving mechanical properties of PI fiber paper,and can improve the heat resistance performance of it,makes the final preparation of paper-based copper clad with good comprehensive performance,including dielectric constant D_(k)is 3.36,dielectric loss D_(f)is between 0 and 0.02,the thermal decomposition temperature T_(d-5%)is 511℃,and the thermal expansion coefficient is 3.31μm/(m·℃).

关 键 词：纸基覆铜板 聚酰亚胺 芳纶 硅微粉 高耐热 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]