红外探测器杜瓦冷头的低温可靠性研究  

Research on Low-Temperature Reliability of the Dewar Cold Head in Infrared Detector

作　　者：付志凯 王冠[1] 韦书领[1] 孟令伟[1] 宁提[1] FU Zhi-kai;WANG Guan;WEI Shu-ling;MENG Ling-wei;NING Ti(North China Research Institute of Electro-Optics,Beijing 100015,China)

机构地区：[1]华北光电技术研究所,北京100015

出　　处：《红外》2022年第11期14-19,48,共7页Infrared

摘　　要：红外探测器杜瓦冷头结构受温度冲击时容易损伤,甚至会导致探测器组件失效。这是红外探测器组件产品研制中不可避免的可靠性问题之一。针对红外探测器杜瓦冷头的低温可靠性问题展开了相关研究。结合粘接失效原理和有限元仿真,讨论了粘接胶厚度、溢胶等情况对杜瓦冷头低温应力、冷头--冷指粘接面积与探测器温度关系的影响。结果表明,胶层状态是影响杜瓦冷头低温损伤和温度传导的重要原因。产品研制过程中可通过控制粘接胶层来降低大面阵探测器粘接结构的低温应力,从而提高冷头结构的低温可靠性。The dewar cold head structure of the infrared detector is easily damaged by temperature impact,which directly leads to the failure of infrared detector components.This is one of the inevitable reliability problems in the development of infrared detector components.The low temperature reliability of the dewar cold head in the infrared detector was studied.Combined with the bonding failure principle and finite element simulation,the influence of adhesive thickness and overflow on the low temperature stress of dewar cold head,the relationship between the bonding area of cold head and cold finger and the detector temperature was discussed.The results show that the state of the adhesive layer is an important factor affecting the low temperature damage and temperature conduction of the dewar cold head.In the process of product development,the low temperature stress of the large array detector bonding structure can be reduced by controlling the adhesive layer,so as to improve the low temperature reliability of the cold head structure.

关 键 词：红外探测器 杜瓦冷头 热应力 

分 类 号：TN215[电子电信—物理电子学]