脉冲电子束作用下Cu-W互不固溶体系固溶拓展研究  

Study on solution expansion of the Cu-W immiscible alloy system by pulsed electron beam

作　　者：田爽 田娜娜 张从林 关锦彤 吕鹏[1] 关庆丰[1] TIAN Shuang;TIAN Nana;ZHANG Conglin;GUAN Jintong;LYU Peng;GUAN Qingfeng(School of Materials Science and Engineering,Jiangsu University,Zhenjiang 212016,China;School of Materials Science and Engineering,Yancheng Institute of Technology,Yancheng 224600,China)

机构地区：[1]江苏大学材料科学与工程学院,镇江212016 [2]盐城工学院材料科学与工程学院,盐城224600

出　　处：《核技术》2022年第12期49-56,共8页Nuclear Techniques

基　　金：国家自然科学基金(No.52001273);江苏省自然科学基金(No.BK20201062)资助。

摘　　要：Cu-W复合材料由于兼具铜的导热性与导电性以及钨的高强度与高温性能而被广泛应用于电力、电子、塑性成形等众多领域。本研究利用电子束快速凝固的特点,提高Cu-W互不相溶合金体系的固溶度,以改善材料性能。采用粉末冶金法制备Cu-W复合材料,并利用强流脉冲电子束(High Current Pulsed Electron Beam,HCPEB)技术对其进行表面改性,研究不同处理工艺参数对样品固溶度和表面硬度的影响。结果表明:在球磨过程中形成了Cu(W)固溶体,球磨5 h时粉末固溶度的提升最为明显。差示扫描量热分析仪(Differential Scanning Calorimeter,DSC)表明,固溶体在烧结的加热过程中会发生脱溶反应。利用强流脉冲电子束对烧结试样表面进行辐照处理,结果表明:HCPEB辐照可有效提高Cu-W互不固溶合金体系的固溶度,致使辐照表面形成Cu(W)过饱和固溶体合金化层。W在Cu基体中的固溶度随辐照次数而增加,10次辐照后Cu(W)固溶体中溶质元素(W)的重量百分比达到了1.63%;辐照表面的硬度随着固溶度的增加而显著增加,固溶强化和弥散强化效应是辐照表面性能改善的根本原因。[Background]Cu-W composites are widely used in electric power,electronics,and plastic forming owing to the excellent electrical and thermal conductivities of copper combined with the outstanding strength and thermal properties of tungsten.[Purpose]This study aims to investigate the extension of the solid solubility of the Cu-W immiscible system under high current pulsed electron beam(HCPEB)irradiation.[Methods]First of all,the Cu-15W powder mixture was sintered by vacuum at 850℃after ball milling for 5 h to prepare the Cu-W composites.After polishing,the Cu-W composites was exposed by a HOPE-1 type HCPEB device with 1,5,10 and 15 pulses,respectively.Then,Rigaku D/Max-2500/pc X-ray diffractometer(XRD)was used to analyze the phase constitutes of the milling powder,sintered samples and irradiated samples.The surface morphology was observed by JEOL JSM-7001F field emission scanning electron microscope(SEM).The energy dispersive spectrometer(EDS)in SEM was used for the examination of micro-region composition.Finally,the microstructures in the modified layer were characterized by JEOL-2100F transmission electron microscopy(TEM).The surface hardness of the sintered and irradiated samples with different pulses was measured using the HVS-1000 Vickers hardness tester.[Results]The results reveal that Cu(W)solid solutions were formed during the process of ball milling,and the mass fraction of the solute element W in the Cu(W)solid solution reaches 0.88%after 5 h of ball milling.It was discovered that the solid solution undergoes exsolution reaction during heating using differential scanning calorimeter(DSC).The sintered sample surface was irradiated by a pulsed electron beam.The results demonstrate the formation of solid solution phase after HCPEB irradiation,whose solubility increases with the increase of the number of pulses.After 10 pulse irradiations,the mass percentage of solute element(W)in Cu(W)solid solutions reaches 1.63%.The surface hardness of irradiated samples increases significantly after HCPEB irradiation,an

关 键 词：强流脉冲电子束 Cu-W 球磨 微观组织 固溶度 

分 类 号：TL1[核科学技术—核能科学]