半导体设备承载板的模态分析及拓扑优化  

Modal Analysis and Topology Optimization of the Bearing Plate for Semiconductor Equipment

作　　者：李龙飞 李树彦 侯得锋 杨师[1] 梅阳 LI Longfei;LI Shuyan;HOU Defeng;YANG Shi;MEI Yang(The 45th Research Institute of CETC,Beijing 101601,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2022年第5期56-59,共4页Equipment for Electronic Products Manufacturing

摘　　要：为提升半导体专用设备的动力学性能,需要对其中的承载板进行结构优化,以确保该零件模态频率和质量满足使用要求。采用有限元软件对优化前的承载板进行模态分析,得到特定边界条件下的垂向模态频率。之后利用拓扑优化的方法,将承载板需要的垂向模态频率作为前提条件,将承载板质量最小化作为目标值,求解承载板的最优结构。根据拓扑优化后的结果,进行几何重构,计算表明优化后承载板的垂向模态频率和质量满足设计需求。In order to improve dynamic performance of semiconductor equipment,structural optimization is needed to ensure that modal frequency and mass of the bearing plate meeting application requirements of the machine.Finite element analysis software is used to analyze modal of the bearing plate before optimization,and the vertical modal frequency under specific boundary conditions is obtained.Then,a topology optimization method is used to solve optimal structure of the bearing plate by taking the required vertical modal frequency as prerequisite and minimizing mass as target value.According to the results of topology optimization,the geometric model is reconstructed.The calculation shows that vertical modal frequency and mass of the optimized bearing plate meet the design requirements.

关 键 词：承载板 模态分析 拓扑优化 模态频率 

分 类 号：TN305[电子电信—物理电子学]