聚酰亚胺复合材料电气绝缘性能的研究进展  被引量:1

Research Progress of Electrical Insulation Properties of PI Composites

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作  者:丁成成 王晓东 黄培 俞娟 Ding Chengcheng;Wang Xiaodong;Huang Pei;Yu Juan(State Key Laboratory of Materials-Oriented Chemical Engineering,College of Chemical Engineering,Nanjing Tech University,Nanjing 211800,China)

机构地区:[1]南京工业大学化工学院材料化学工程国家重点实验室,南京211800

出  处:《工程塑料应用》2022年第12期149-154,共6页Engineering Plastics Application

摘  要:综述了聚酰亚胺(PI)及其复合材料在电气绝缘领域的最新研究进展,简述了陶瓷类、粘土类、聚硅烷类等无机纳米粒子对PI耐电晕的改性和研究,并从PI基体的分子摩尔极化率和自由体积出发,介绍了不同改性填料对PI介电性能的作用和影响,对PI基复合材料未来在电气绝缘领域的研究方向进行了展望。The latest research progress of polyimide(PI)and its composite materials in the field of electrical insulation was reviewed,and the modification and study of the corona resistance of PI by inorganic nanoparticles such as ceramics,clay and polysilane were briefly described.Based on the molecular mole polarization and free volume of PI matrix,the effects of different modified fillers on the dielectric properties of PI were introduced.The future research direction of PI matrix composites in the field of electrical insulation was prospected.

关 键 词:聚酰亚胺 复合材料 电气绝缘 耐电晕 介电性能 

分 类 号:TQ323.7[化学工程—合成树脂塑料工业]

 

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