An investigation on application potentiality of microstructure heat sinks with different flow topological morphology  

作　　者：YAO XiaoLe SHI QianLei LIU Qian QIN Le JU Xing XU Chao 

机构地区：[1]Key Laboratory of Power Station Energy Transfer Conversion and System of MOE,North China Electric Power University,Beijing 102206,China

出　　处：《Science China(Technological Sciences)》2022年第12期2895-2909,共15页中国科学（技术科学英文版）

基　　金：supported by the National Natural Science Foundation of China(Grant No.51876062);the Interdisciplinary Innovation Program of North China Electric Power University。

摘　　要：Microstructure heat sinks have great potential for high heat flux cooling.In this paper,we compared microchannel(MC),micro-pin-fin(MPF),manifold microchannel(MMC),and manifold micro-pin-fin(MMPF)heat sinks to figure out the pros and cons.Fluid flow and manifold unit models are used to study thermal and hydrodynamic performance.The heat sinks with different channel/fin sizes,manifold numbers,and porosities are discussed according to the pressure drop,temperature,thermal resistance,and coefficient of performance.Results show that MMC and MMPF heat sinks are superior to MC and MPF heat sinks,and there are also differences between MMC and MMPF heat sinks.Typically,the MMPF heat sink has lower maximum temperature,temperature non-uniformity,and total thermal resistance R_(tot).In contrast,the MMC heat sink has a lower pressure drop and higher COP.For the MMPF heat sink,at the nozzle width of 6.75μm and the MPF width of 70.71μm(porosity=0.167),it achieves the lowest total thermal resistance of R_(tot)=2.97×10^(-6)K m^(2)/W.Under 10^(3)W/cm^(2)heat flux,the maximum surface temperature rise is 29.74 K,and the maximum temperature difference of the heating surface is 3.15 K.This research initially provides a clear reference on the selection of single-phase cooling microstructures for ultra-high heat flux dissipation.

关 键 词：heat sink topology MANIFOLD MICROCHANNEL micro-pin-fin high heat flux 

分 类 号：TN40[电子电信—微电子学与固体电子学] TK172[动力工程及工程热物理—热能工程]