环氧基聚硅氧烷改性氰酸酯树脂研究  

Study on polysiloxane modified cyanate resin

作　　者：张晓男 吴健伟[1] 魏运召[1] 孙鹏鹏[1] 付刚[1] ZHANG Xiaonan;WU Jianwei;WEI Yunzhao;SUN Pengpeng;FU Gang(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,Heilongjiang China)

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040

出　　处：《粘接》2022年第12期1-5,共5页Adhesion

摘　　要：以二甲基二乙氧基、二苯基二甲氧基和γ-(2,3-环氧丙氧)丙基三甲氧基硅烷为单体,通过水解缩合制备了三种含有环氧基的甲基苯基聚硅氧烷(EPSi),以EPSi改性氰酸酯(CE)共聚树脂,研究了不同环氧基含量的聚硅氧烷改性CE树脂的固化反应活性、热性能、力学性能、以及吸湿性。结果表明,EPSi1(环氧基含量2.2%)的加入大幅降低了CE树脂的固化反应温度,添加量为CE树脂的质量的25%时,改性CE树脂5%热失重温度达457.0℃,玻璃化转变温度达284.0℃,拉伸强度从68.1 MPa提升至84.7 MPa,弯曲强度从100.0 MPa提升至118.3 MPa,冲击强度从8.3 kJ/m^(2)提高至12.9 kJ/m^(2),水与其表面的接触角从71.5°提升至95.6°,吸水率从2.44%降低至1.52%。Using dimethyldiethoxy,diphenyldimethoxy,γ-(2,3-glycidoxy)propyltrimethoxysilane as monomers,three methylphenyl polysiloxanes(EPSI)containing epoxy groups were prepared by hydrolytic condensation.Cyanate ester(CE)copolymer resin modified with EPSi,the curing reactivity,thermal properties,mechanical properties and hygroscopicity of CE resin modified by polysiloxane with different epoxy groups were studied.The results show that the addition of EPSi1(epoxy content of 2.2%)greatly reduced the curing reaction temperature of CE resin.When the addition amount was 25%of the mass of CE resin,the thermal weight loss temperature of 5%modified CE resin reached 457.0℃,and the glass transition temperature reached 284.0℃,the tensile strength increased from 68.1 MPa to 84.7 MPa,the bending strength increased from 100.0 MPa to 118.3 MPa,the impact strength increased from 8.3 kJ/㎡to 12.9 kJ/㎡,the contact angle between water and its surface increased from 71.5°increased to 95.6°,and the water absorption decreased from 2.44%to 1.52%.

关 键 词：胶粘剂 氰酸酯树脂 改性 热稳定性 粘接性能 

分 类 号：V258[一般工业技术—材料科学与工程] TQ320.1[航空宇航科学与技术—航空宇航制造工程] TB332[化学工程—合成树脂塑料工业]