声阻法胶接结构缺陷实时成像检测  

Study on real-time imaging detection of bonding defects by acoustic impedance method

作　　者：迟大钊[1] 郭涛[1] 张闰琦 张涛 申浩 CHI Dazhao;GUO Tao;ZHANG Runqi;ZHANG Tao;SHEN Hao(Harbin Institute of Technology,State Key Laboratory of Advanced Welding and Joining,Harbin 150001;National Innovation Center of High Speed Train,Qingdao 266000)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001 [2]国家高速列车青岛技术创新中心,青岛266000

出　　处：《焊接学报》2022年第11期107-111,I0008,I0009,共7页Transactions of The China Welding Institution

基　　金：国家高速列车技术创新中心研发计划(CXKY-02-03(2020));国家自然科学基金资助项目(51375002)。

摘　　要：为了有效检测胶接结构缺陷,构建了基于声阻法的成像检测系统.系统包括声学信号采集、声学探头定位、数据处理及绘图三部分.利用两轮式编码器,实现了动态扫查过程探头位置信息的采集;利用结合质量检测仪采集缺陷信息;采用C++编写了数据处理及图像绘制程序,实现了胶接结构缺陷声阻法实时成像检测.利用声阻法及常规超声C扫描成像方法对铝合金/环氧树脂/铝合金三明治胶接结构进行了检测,并对检测结果进行了分析对比.结果表明,声阻法能更有效识别胶接结构中的缺陷,且单面检测即可满足缺陷表征需求.In order to detect the bonded structure defects effectively, an imaging inspection system based on acoustic impedance method is constructed. The system includes three parts: acoustic signal acquisition, acoustic probe positioning,data processing and imaging. Probe positions during dynamic scanning are collected using two rotary encoders. The defect data are collected using a Bonding Quality Detector. The data processing and image drawing programs are written in C++ language. The bonded sandwich structure of aluminum alloy/epoxy resin/aluminum alloy was tested using both acoustic impedance and conventional ultrasonic C-scan imaging methods, and the test results were compared and analyzed. The results show that the acoustic impedance based imaging method can identify defects in bonded structures more effectively,and single-sided testing can meet the needs of defect detection.

关 键 词：无损检测 胶接结构 缺陷识别 声阻法 

分 类 号：TG441.7[金属学及工艺—焊接]