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作 者:张玉 ZHANG Yu(School of Artificial Intelligence,Hefei University of Economics,Hefei Anhui 230011,China)
机构地区:[1]合肥经济学院人工智能学院,安徽合肥230011
出 处:《信息与电脑》2022年第18期32-35,共4页Information & Computer
摘 要:随着物联网产品技术的快速发展,传统微控制器片上FLASH已经无法满足代码容量的需求,通过微控制单元(Microcontroller Unit,MCU)外挂一颗Nor Flash的方案已经成为主流设计。针对外部SPI Nor Flash的代码烧录问题,一般由串行外设接口(Serial Peripheral Interface,SPI)烧录器直接通过硬件连接SPI Flash外部引脚进行烧录,然后焊接到电路板上,后续将无法再次烧录。本文以RISC-V内核GD32VF103C8T6微控制器外挂GD32Q16 SPI FLASH为例,研究并设计一种烧录算法实现外部SPI FLASH的高速烧录。With the rapid development of IoT product technology,the traditional microcontroller on-chip FLASH can no longer meet the demand of code capacity,through the Microcontroller Unit(MCU)external a Nor Flash program has become the mainstream design.For the external SPI Nor Flash code burning problem,generally by the Serial Peripheral Interface(SPI)burner directly through the hardware connection SPI Flash external pins for burning,and then soldered to the board,the subsequent will not be burned again.In this paper,we take the RISC-V core GD32VF103C8T6 microcontroller with GD32Q16 SPI FLASH as an example,and design a burning algorithm to achieve high-speed burning of external SPI FLASH.
分 类 号:TP322.3[自动化与计算机技术—计算机系统结构]
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