锡铅钎料粘塑性行为及其本构描述  

Visco-Plastic Behavior and Constitutive Model for Lead Solder

作　　者：邢睿思 王龙[1] 侯传涛[1] 宋俊柏 XING Ruisi;WANG Long;HOU Chuantao;SONG Junbai(Science and Technology on Reliability and Environmental Engineering Laboratory,Beijing Institute of Structure and Environment Engineering,Beijing 100076,China)

机构地区：[1]北京强度环境研究所可靠性与环境工程技术重点实验室,北京100076

出　　处：《力学季刊》2022年第3期712-720,共9页Chinese Quarterly of Mechanics

摘　　要：随着航天事业的发展,航天电子产品使用环境变得越来越复杂苛刻,对焊点可靠性要求日益提高,因此,研究焊点材料服役环境下的本构关系对于分析焊点性能、准确预测焊点可靠性具有重要意义.本文分析锡铅钎料Sn63Pb37在-45~150℃温度范围内和10^(-5)~10^(-3)/s应变率范围内的粘塑性行为,在此基础上,建立了修正的Anand本构模型.通过构建材料参数与温度的函数关系,提升Anand本构模型在不同环境温度尤其是低温环境下对材料应力-应变关系的预测能力,为航天电子产品可靠性设计提供技术支撑.With the development of aerospace engineering,the application environment of aerospace electronic products is getting more and more complex,and the requirements for the reliability of solder joints are increasing.Thus,investigating the constitutive relation of the lead solders under the service environment is of great importance to analyze the properties and accurately predict the reliability of solder joints.In this paper,the visco-plastic behavior of Sn63Pb37 solder alloy at temperature ranging from -45℃ to 150℃ under the strain rate ranging from 10^(-5) to 10^(-3)/s is investigated.Based on the results,a modified Anand constitutive model is proposed to predict the stress-strain relation of Sn63Pb37 solder alloy more accurately under different temperatures,especially under the low temperature,providing technical support to reliability design of electronic products.

关 键 词：锡铅钎料 Anand模型 粘塑性 本构模型 

分 类 号：O346[理学—固体力学]