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作 者:刘家良 赵知辛[1] 黄鸣远 陈小龙 Liu Jialiang;Zhao Zhixin;Huang Mingyuan;Chen Xiaolong(School of Mechanical Engineering,Shaanxi University of Technology,Hanzhong 723001,China)
出 处:《低温与超导》2022年第11期62-69,共8页Cryogenics and Superconductivity
基 金:陕西省科技厅重点研发计划(2019GY-068);陕西省教育厅专项科研计划(16JK1147)资助。
摘 要:针对智能手机中高功率5G芯片及大容量锂离子电池的散热问题,提出一种新型散热结构。该结构采用质量分数为92%的石蜡/石墨与质量配比为64:36的月桂酸/肉豆蔻酸分别作为5G芯片及锂离子电池的相变冷却介质,并通过石墨烯和铜箔组成的复合散热层协助散热。通过数值分析,研究了相变材料的液相体积分数,融化率及各元件温度。结果表明:随相变材料融化率的增大,对元件温升的抑制效果越明显。在5G芯片与锂离子电池中采用不同物理性质的相变材料使其温度分别下降了8.67%,10.49%,散热效果较为明显。复合散热层的加入可以有效降低手机内部温度,提升智能手机的安全可靠性。Aiming at the heat dissipation of high power 5 G chip and large capacity lithium ion battery in smart phone,a novel kind of heat dissipation structure was proposed.It was suggested to use paraffin wax/graphite with a mass fraction of 92%and lauric acid/myristic acid with a mass ratio of 64:36 as the phase change cooling medium for 5 G chips and lithium-ion batteries,respectively.Through numerical analysis,the liquid volume fraction,melting rate and temperature of each element of the phase change material were studied.The results show that the more the melting rate of PCM increases,the more obvious the restraining effect on the temperature rise of PCM is.The temperature of 5 G chip and lithium-ion battery decreases by 8.67%and 10.49%respectively by using different physical properties of PCM.The addition of the composite heat sink layer can effectively reduce the internal temperature of the smartphone and enhance the security and reliability of the smartphone.
分 类 号:TK124[动力工程及工程热物理—工程热物理]
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