基板表面特性对镀铬层的影响  

Influence of Substrate Surface Characteristics on Chromium Plating Layer

作　　者：王俊怡[1] WANG Jun-yi(Baoshan Iron&Steel Co.,Ltd.,Shanghai 201999,China)

机构地区：[1]宝山钢铁股份有限公司冷轧厂,上海201999

出　　处：《材料保护》2022年第12期14-21,共8页Materials Protection

摘　　要：为明确镀铬过程中基板的表面特性对其表面形成的镀铬层的影响,通过X射线光电子能谱仪(XPS)、X射线衍射仪(XRD)、场发射扫描电子显微镜(FESEM)、原子力显微镜(AFM)以及电化学测试表征了不同基板的表面状态。结果表明:较低的表面粗糙度和较多的波峰数为含铬化合物在基板表面的沉积提供了更多的活性位点,促进了镀铬层的生长。基板表面的晶粒取向会影响含铬化合物的生长,晶粒取向越复杂,镀铬层的缺陷越多。基板表面氧化膜越厚,表面的化学活性越差,形成的镀铬层的质量越差。In order to clarify the influence of the surface characteristics of the substrate on the chromium plating layer formed on the surface during the chromium plating process,the surface states of different substrates were characterized by X-ray photoelectron spectroscopy(XPS),X-ray diffraction(XRD),field emission scanning electron microscopy(FESEM),atomic force microscopy(AFM)and electrochemical test.Results showed that lower surface roughness and more peaks provided more active sites for the deposition of chromium-containing compounds on the substrate surface,which promoted the growth of the chromium plating layer.The grain orientation on the substrate surface would affect the growth of chromium-containing compounds,precisely,higher grain orientation complexity would lead to more defects in the chromium plating layer.Besides,larger oxide film thickness on the surface of the substrate would lead to worse chemical activity of the surface and poorer chromium plating layer quality.

关 键 词：粗糙度 晶粒取向 氧化膜 镀铬层 

分 类 号：TG174.4[金属学及工艺—金属表面处理]