电沉积镍钨合金多层膜耐蚀性能研究  

Study on corrosion resistance of electrodeposited nickel-tungsten multilayer film

作　　者：陈汉斌 夏江冰 龚政 黄钰林 杭弢[1] Chen Hanbin;Xia Jiangbing;Gong Zheng;Huang Yulin;Hang Tao(School of Material Science and Engineering,Shanghai Jiao Tong University,Shanghai 200240,China)

机构地区：[1]上海交通大学材料科学与工程学院,上海200240

出　　处：《电镀与精饰》2023年第1期1-7,共7页Plating & Finishing

基　　金：国家自然科学基金资助项目(21972091)。

摘　　要：为满足微电子器件在极端环境中的服役要求,提升镍基合金薄膜镀层在工业应用中的耐蚀性,采用电沉积的方法得到单层及多层镍钨合金薄膜,研究了多层镀层对镍钨镀层耐蚀性能的影响。结果表明:在相同镀层厚度条件下,采用多层镍钨合金沉积方式能够提升镀层的耐蚀性能,为改善镀层耐蚀性能提供了一种方便而有效的途径。In order to meet the requirement of using micro-electronic device under extreme conditions,and to improve the corrosion resistance of nickel-based alloy thin film,mono-layered and multilayered nickel-tungsten thin films were fabricated by electrodeposition. The influence of the multilayer structure to the corrosion resistance of the film was investigated. The results show that the corrosion resistance of the deposited film in a certain thickness was enhanced with the increasing of the layers numbers. It indicates a convenient and effective way to modulate the corrosion resistance of deposited film.

关 键 词：镍钨合金 耐蚀性能 多层结构 脉冲电沉积 

分 类 号：TQ153.2[化学工程—电化学工业]