锡膏测厚仪的计量现状和解决方法  

The meterage status and solution of solder paste inspection system

作　　者：刘娟 梅啸[1] 席晶晶 黄红平 王稚源 朱自俊 卫宇星 Liu Juan;Mei Xiao;Xi Jingjing;Huang Hongping;Wang Zhiyuan;Zhu Zijun;Wei Yuxing(Suzhou Industrial Park Institute of Services Outsourcing;Suzhou Institute of Metrology)

机构地区：[1]苏州工业园区服务外包职业学院 [2]苏州市计量测试院

出　　处：《上海计量测试》2022年第4期43-45,47,共4页Shanghai Measurement and Testing

摘　　要：介绍了锡膏测厚仪的产业现状和需求,阐述了现有的金属量块标准器存在的问题。针对金属量块标准器表面不能形成漫反射导致无法成像的问题,自主研制了稳定性好、市场应用范围广的标准器。采用黑色磷化工艺,在基座和台阶表面形成一层黑色的磷化膜,使其具有漫反射表面特征,同时满足激光非接触式和其他类型扫描形式测量仪器的校准需求。该标准器可满足市场上大部分如锡膏测厚仪等非接触式表面形貌测量仪器的校准,确保测量结果的准确及可溯源。The industry status and demand of solder paste thickness gauge are introduced, and the existing problems of metal gauge standard are expounded.The surface of metal gauge can not form diffuse reflection, which leads to imaging failure. Aiming at these problems,a standard with good stability and a wide range of market application is developed independently. Black phosphating process is adopted to form a black phosphating film on the surface of the base and step, so that it has diffuse surface characteristics, and at the same time meet the calibration requirements of laser non-contact and other types of scanning measurement instruments. This standard can satisfy the calibration of most non-contact surface topography measuring instruments on the market, such as solder paste thickness measuring instrument, to ensure the accurate and traceable measurement results.

关 键 词：锡膏测厚仪 标准器 黑色磷化 

分 类 号：TH821.1[机械工程—仪器科学与技术]