塑封光电耦合器失效及其应用问题探究  

Failure of plastic optocoupler and its applied problem exploration

作　　者：阮若琳 王跃峰 王英飞 李亚娟 RUAN Ruolin;WANG Yuefeng;WANG Yingfei;LI Yajuan(AVIC JONHON Optronic Technology Co.,Ltd.,Luoyang 471000,China)

机构地区：[1]中航光电科技股份有限公司,河南洛阳471000

出　　处：《现代电子技术》2023年第2期169-175,共7页Modern Electronics Technique

摘　　要：光电耦合器以光为媒介传输电信号,广泛应用于各种领域的隔离信号传输。文中以某塑封光耦使用失效的问题为例,从元器件的失效分析结果探究其工程应用的优化方向。采用声学扫描、X-ray、开封检查及能谱分析等失效分析手段对失效器件进行分析,并对失效分析的内容依次探究解读,分析其受热应力、受潮、受腐蚀和工艺控制,及Au—Al键合点的IMC和Kirkendall空洞生成加速致使键合点开裂等方面的可能性。进一步对失效器件的电路设计及应用进行分析,从选型、电路工作参数计算出发,分析其输出端的设计缺陷和3只光耦并联的输出端电流工作状态,并进行结温计算,给出对电路设计状态的最终分析结论和其电路应用的优化方案,整理光耦选用要点和注意事项,为广大工程应用及电路设计者提供参考。Optocoupler uses light as the medium to transmit electrical signals,and is widely used in various fields to isolate signal transmission. Taking the failure of a plastic encapsulated optocoupler as an example,the optimization direction of its engineering application are explored from the failure analysis results of components. The failure analysis methods such as acoustic scanning,X-ray,unsealing inspection and energy spectrum analysis are used to analyze the failure device,and the contents of the failure analysis are explored and interpreted one by one to analyze the possibility of thermal stress,moisture,corrosion and process control,as well as the cracking of the bonding point caused by the accelerated formation of IMC and Kirkendall cavities in the Au—Al bonding point. The circuit design and application of the failed device are analyzed. From the perspective of type selection and circuit working parameter calculation,the design defects of its output end and the current working state of the output end of three optocouplers in parallel are analyzed,and the junction temperature calculation is carried out. The final analysis conclusion of the circuit design state and the optimization scheme of its circuit application are given,and the key points and precautions for optocoupler selection are arranged to provide reference for the vast engineering applications and circuit designers.

关 键 词：光耦 塑封封装 失效分析 Au—Al键合失效 电路设计 电路应用 优化方案 选用要求 

分 类 号：TN622-34[电子电信—电路与系统] V271.4[航空宇航科学与技术—飞行器设计]