提高挠性网状金属基材镀层结合力的工艺研究  

Study on technology of improving plating adhesion of the flexible mesh metal substrate

作　　者：肖乐银 秦海青 陈超 莫培程 潘晓毅 陈家荣 XIAO Leyin;QIN Haiqing;CHEN Chao;MO Peichen;PAN Xiaoyi;CHEN Jiarong(China Nonferrous Metals(Guilin)Geology And Mining Co.,Ltd.,Guilin 541004,China;Guangxi Key Laboratory of Superhard Materiasl,China Nonferrous Metals(Guilin)Geology And Mining Co.,Ltd.,Guilin 541004,China;Chinese National Engineering Research Center for Special Materials,China Nonferrous Metals(Guilin)Geology And Mining Co.,Ltd.,Guilin 541004,China)

机构地区：[1]中国有色桂林矿产地质研究院有限公司,广西桂林541004 [2]中国有色桂林矿产地质研究院有限公司广西超硬材料重点实验室,广西桂林541004 [3]中国有色桂林矿产地质研究院有限公司国家特种矿物材料工程技术研究中心,广西桂林541004

出　　处：《超硬材料工程》2022年第5期7-13,共7页Superhard Material Engineering

基　　金：广西重点实验室运行补助项目(22-035-35);广西重点研发项目(AB20159010)。

摘　　要：文章研究了镀液类型、镀前处理、电源波形及热处理对挠性网状金属镀层结合力的影响。结果表明:氨基磺酸盐镀镍溶液电镀层的结合力要优于瓦特型镀液,更适合挠性网状金属基材电镀,通过采用电化学强浸蚀镀前处理工艺,电沉积金属镍原子与基材之间部分形成金属键结合,镀点结合强度由3.58 MPa提高到4.62 MPa,且部分镀点能够连同基体一起开裂;脉冲电源能有效改善镀液的深镀能力,相比直流电源,钢网钢丝的镀层包裹程度达到70%,加强了镀层与基材之间的包裹咬合作用,提高彼此之间的机械结合强度;在450℃下热处理30 min,能够有效消除镀层内部的应力,结合强度由6.92 MPa提高到7.68 MPa,所有镀点的结合强度大于基材本身的强度,完全能满足使用要求。In this paper,the effect of plating solution type,plating pretreatment,power supply waveform and heat treatment on the bonding force of flexible reticulated metal plating layer is investigated.The study resultshows that the bonding force of the plated layer of nickel sulphamate solution is better than that of the watt type plating solution and it is more suitable for plating of flexible reticulated metal substrate.By using the electrochemical strong leaching pretreatment process,the metal bonding between the electrodeposited nickel atoms and the substrate is partially formed,and the bonding strength of the plating point is increased from 3.58 MPa to 4.62 MPa,and some of the plating points can be cracked together with the substrate.The pulsed power supply effectively improves the deep plating capability of the plating solution for the wrapping degree of plating layer of the stencil wire reaches 70%compared to the DC power supply.It strengthens the wrapping bite between the plating layer and the substrate and increases the mechanical bond strength between them.Heat treatment at 450℃for 30 minutes effectively removes the stresses within the plating layer and increases the bond strength from 6.92 MPa to 7.68 MPa.The bonding strength of all the plated spots is greater than the strength of the substrate itself,which is fully capable to meet the utilization requirements.

关 键 词：网状金属 结合力 电镀溶液 电源波形 热处理 

分 类 号：TQ164[化学工程—高温制品工业]