石墨烯化学镀铜及增强铜基复合块材的制备  

Electroless Copper Plating on Graphene and Preparation of Reinforced Copper Based Composite Block

作　　者：段涛 金利华[2] 梁明[2] 肖鹏[1] 王鹏飞[2] 吴艺凡 景珂超 张胜楠[2] 冯建情[2] 李成山[2] DUAN Tao;JIN Lihua;LIANG Ming;XIAO Peng;WANG Pengfei;WU Yifan;JING Kechao;ZHANG Shengnan;FENG Jianqing;LI Chengshang(School of Materials Science and Engineering of Xi an University of Technology,Xi an 710084,China;Superconducting Materials Research Center,Northwest Institute For Non-ferrous Metal Research,Xi an 710016,China)

机构地区：[1]西安理工大学材料科学与工程学院,西安710084 [2]西北有色金属研究院超导材料研究所,西安710016

出　　处：《材料导报》2022年第S02期300-303,共4页Materials Reports

基　　金：国家自然科学基金(52073233);陕西省重点研发计划一般项目(2022GY-376)。

摘　　要：为了改善石墨烯与铜界面的浸润性和石墨烯在铜基体中的分散性,本工作采用化学镀结合球磨的方式,制备了石墨烯增强铜基复合材料。采用扫描电镜、X射线衍射仪、拉曼光谱仪、X射线光电子能谱仪、硬度仪和电导测试等对石墨烯增强铜基复合材料的微观结构、力学性能和电学性能进行研究。结果表明:采用化学镀法,成功在石墨烯表面均匀生长出纳米铜粒子。纳米铜粒子沉积在石墨烯表面,并插入到石墨烯片层中间,改善了石墨烯与铜界面的浸润性。将石墨烯镀铜粉末与铜粉混合后,经球磨处理制备出石墨烯铜复合块体。石墨烯均匀分散在铜基体中,有效地提高了复合材料的综合性能。复合块体硬度达到104HV,较纯铜硬度提高约1.6倍;电导率达90%IACS,表现出良好的导电性能。In order to improve the interfacial wettability between graphene and copper and the dispersion of graphene in copper matrix,electrolessplating and ball grinding were adopted to prepare graphene reinforced copper matrix composites.The microstructure,mechanical properties and electrical properties of graphene reinforced copper matrix composites were studied by scanning electron microscopy,X-ray diffraction,Raman spectroscopy,X-ray photoelectron spectroscopy,hardness and conductivity tests.The results elucidate that copper nanoparticles were successfully grown on the surface of graphene by electroless plating.Copper nanoparticles were deposited on the surface of graphene and inserted into the interlayer of graphene,enhancing the wettability between graphene and copper.The graphene-copper bulk was prepared by ball milling of the mixed graphene copper plating powder and copper powder.Graphene is uniformly dispersed in the copper matrix,effectively improving the properties of the bulk.The hardness of the bulk reaches 104 HV,which is almost 1.6 times higher than that of pure copper.The conductivity reaches 90%IACS,demonstrating an excellent conductivity.

关 键 词：石墨烯 铜基复合材料 化学镀 球磨 硬度 电导 

分 类 号：TB331[一般工业技术—材料科学与工程]