5G基站散热盖板的热设计优化  

Thermal Design Optimization of Top Cover of 5G Base Station

作　　者：段凯文 刘欣 刘帆[1,2] DUAN Kaiwen;LIU Xin;LIU Fan(State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen 518055,China;Zhongxing Telecommunication Equipment Corporation,Shenzhen 518055,China)

机构地区：[1]移动网络和移动多媒体技术国家重点实验室,广东深圳518055 [2]中兴通讯股份有限公司,广东深圳518055

出　　处：《电子机械工程》2022年第6期37-42,51,共7页Electro-Mechanical Engineering

摘　　要：文中以有源天线单元(Active Antenna Unit,AAU)为研究对象,针对其铆接盖板开展热设计优化,以实现散热性能的提升。将相变抑制(Phase Change Inhibited,PCI)齿的顶部折弯为L型并相互扣合,形成一体式L齿盖板结构,取代原铆接盖板。通过散热路径分析、仿真分析和实测验证对比L齿盖板和铆接盖板的性能收益。研究结论表明:L齿盖板与PCI齿之间无接触热阻,盖板平均温度升高,盖板散热性能显著提升;关键芯片降温0.4℃~1.0℃,仿真与实测趋于一致;齿高等效降低8 mm,总体减重0.45 kg;推荐开孔宽度为(3±0.5)mm,推荐开孔率为25%~30%。In this paper,the thermal design optimization is carried out for the riveted top cover of the active antenna unit(AAU)in order to improve its cooling efficiency.By bending the top of the phase change inhibited(PCI)fins to L-shape and interlocking the top bent parts with each other,an integrated top cover with L-shaped fins can be built,which replaces the original top cover.This study compares the performance gains of the L-fins top cover with that of the riveted top cover through thermal analysis of heat dissipation,simulation analysis and experimental verification.The research conclusions are as follows:there is no thermal contact resistance between the L-fins top cover and the PCI fins,hence the average temperature of top cover increases and the cooling performance of top cover improves significantly;the temperatures of key chips decrease by 0.4℃to1.0℃,the simulation and experimental results are consistent;the fin height can be reduced equivalently by8 mm and the overall weight can be reduced by 0.45 kg;the recommended hole width is(3±0.5)mm and the recommended open ratio is 25%to 30%.

关 键 词：接触热阻 开孔优化 热设计 5G基站 

分 类 号：TK124[动力工程及工程热物理—工程热物理]