半导体封装测试与可靠性课程思政改革探索  

作　　者：任敏[1] 高巍[1] 李泽宏[1] 张波[1] 

机构地区：[1]电子科技大学集成电路科学与工程学院(示范性微电子学院),成都610054

出　　处：《高教学刊》2023年第2期178-181,共4页Journal of Higher Education

基　　金：2019年教育部产学合作协同育人项目“‘新工科’背景下基于产教融合的《微电子器件》课程改革与建设”(201902082005)。

摘　　要：半导体封装测试与可靠性是面向微电子相关专业博士硕士研究生开设的专业选修课,系统讲授集成电路发展过程中不同历史阶段出现的典型半导体封装测试与可靠性技术,为学生成为微电子领域专业研发人员打下了理论基础。课程思政改革是新时期高校教育教学工作的核心内容之一。该课程组基于半导体封装测试与可靠性课程的专业特点,充分发掘课程中的思政元素,优化教学内容和教学方法,提出实施课程思政的具体措施。改革有效地提高课程教学质量和本专业研究生培养质量。"Semiconductor Packaging Testing and Reliability" is a professional elective course for doctoral and master students majored in microelectronics, which systematically teaches typical semiconductor packaging, testing and reliability technologies that appear in different historical stages of the development of integrated circuits, laying a theoretical foundation for students to become professional researchers in the field of microelectronics. The ideological and political reform of the curriculum is one of the core contents of the education and teaching work of colleges and universities in the new period. Based on the characteristics of the course "Semiconductor Packaging Testing and Reliability", the course group fully explores the ideological elements in the curriculum, optimizes the teaching content and teaching methods, and proposes specific measures for the implementation of the curriculum. The reform has effectively improved the quality of course teaching and the quality of postgraduate training in this major.

关 键 词：半导体封装测试与可靠性 课程思政 教学改革 研究生培养 微电子 

分 类 号：G642[文化科学—高等教育学]