AgCuInSn钎料的研究进展综述  

Review on research progress of AgCuInSn solder

作　　者：毕亚男 张乃千 魏明霞 赵君[1] 王剑平[1] 陈松[1] BI Ya-nan;ZHANG Nai-qian;WEI Ming-xia;ZHAO Jun;WANG Jian-ping;CHEN Song(Kunming Institute of Precious Metals,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co.Ltd.,Kunming 650106,China;China Aviation Development Shenyang Liming Aero Engine Co.,Ltd.,Shenyang 110043,Liaoning,China)

机构地区：[1]昆明贵金属研究所,贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室,昆明650106 [2]中国航发沈阳黎明航空发动机有限责任公司,沈阳110043

出　　处：《贵金属》2022年第S01期37-41,共5页Precious Metals

基　　金：国家科技部“科技助力经济2020”重点专项;云南省稀贵金属材料基因工程(202002AB080001-1);云南省2019材料基因工程项目(2019ZE001-2);云南省科技人才与平台计划(202105AE160027)。

摘　　要：AgCuInSn钎料作为一种典型的电真空钎料,具有理想的焊接温度、优良的润湿性能,但也存在脆性大、塑性差、加工困难的缺点,其制备方法一直是研究的重点和难点。分析了AgCuInSn钎料的优缺点,综述了该钎料的研究进展,还列举了AgCuInSn合金钎料的一般制备方法,并对该系列钎料的发展做出了展望。AgCuInSn solder,as a typical electric vacuum solder,has ideal soldering temperature and excellent wetting performance,but it also has the shortcomings of high brittleness,poor plasticity,and difficult processing.Its preparation method has always been a research key point and difficulties.This article analyzes the advantages and disadvantages of AgCuInSn solders,summarizes the research progress of the solders,and also lists the general preparation methods of AgCuInSn alloy solders,and prospects the development of this series of solders.

关 键 词：AgCuInSn钎料 银基钎料 制备方法 研究进展 

分 类 号：TG146.3[一般工业技术—材料科学与工程]