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作 者:赵小莉 刘学毅 Zhao Xiaoli;Liu Xueyi(Space Star Technology Co.,Ltd.,Beijing 100095,China)
出 处:《质量与可靠性》2022年第5期1-6,共6页Quality and Reliability
摘 要:系统级芯片(System on Chip, SoC)是一款设计复杂度高、研制生产流程复杂的芯片。为了保证SoC芯片的设计质量,实现一次流片成功,针对宇航用SoC芯片数量少、成本高、可靠性高的产品特点和存在的问题及风险点,通过不断的研究和实践,形成了一套SoC芯片研制生产过程的精细化产品保证方法。重点介绍了产品保证技术要素和产品保证流程,通过产品保证技术要素落实风险点和关键点的管控措施,并结合前端设计、后端设计、封装筛选及考核试验阶段重点阐述了产品保证技术要素在产品保证流程中的实现,以及产品保证流程与技术流程的融合。通过过程质量确认,保障了宇航SoC芯片精细化产品保证工作的全面实施,从而大幅度提升了星载导航SoC芯片的产品合格率和产品质量。SoC(System on Chip, SoC) chip is a system-level chip with high design complexity,complicated development and production process. In order to ensure the design quality of SoC chip and achieve successful tape-out, a set of refined product guarantee methods for the development and production process of SoC chip is formed through continuous research and practice, aiming at the characteristics of SoC chip for aerospace, such as small batch, high cost and high reliability, as well as the existing problems and risks. This paper mainly introduces the product guarantee elements and product assurance processes, through the product assurance technical elements to carry out the risk points and key points of control measures,combined with the front-end design, the back-end design, encapsulation screening and examination and test phases focusing on the implementation of product assurance technical elements in the product assurance process. Through the process quality confirmation, it ensures the comprehensive implementation of the refined product assurance work of aerospace SoC chip, thus which greatly improves the product qualification rate and product quality of spaceborne navigation SoC chip.
关 键 词:SOC芯片 技术流程 产品保证要素 前端设计 后端设计 质量确认
分 类 号:TN96[电子电信—信号与信息处理] TN47[电子电信—信息与通信工程]
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