厚铜印制板镀金工艺导线蚀刻后的凹槽填充研究  

Study on the filling of the groove after the etching of the process wire on thick copper PB with gold plating

作　　者：陈市伟 徐天亚 黄学 Chen shiwei;Xu tian ya;Huang xue(APCB Electronics(Kunshan)Co.,Ltd.)

机构地区：[1]竞陆电子(昆山)有限公司研发中心,江苏昆山215000 [2]竞陆电子(昆山)有限公司,江苏昆山215000

出　　处：《印制电路信息》2022年第12期44-46,共3页Printed Circuit Information

摘　　要：文章主要阐述一种具有厚铜和镀金插头双面板,由外置工艺导线蚀刻后产生方形凹槽,需要采用绝缘油墨填充在凹槽内。对此凹槽填充工艺进行了研究验证,在不增加原有工艺流程及成本的基础上,探索并导入一种凹槽印刷新工艺流程,以满足客户对外观之要求。This paper mainly describes a kind of double-sided board with thick copper and edge board contact.The square groove is formed after the external process wire is etched. The groove needs to be filled with insulating ink.Thisgroove filling process is researched and verified. On the basis of not increasing the original process and cost, a new groove printing process is explored and introduced to meet the customer’s requirements for appearance.

关 键 词：厚铜印制板 工艺导线 二次蚀刻 凹槽印刷填充 

分 类 号：TN41[电子电信—微电子学与固体电子学]