硅堆球面压装结构的可靠性分析  

Reliability Analysis of Spherical Press-fit Structure of Silicon Stack

作　　者：陈新 王智勇 韩玉辉 李德召 许元震 刘少飞 CHEN Xin;WANG Zhiyong;HAN Yuhui;LI Dezhao;XU Yuanzhen;LIU Shaofei(NR Electric Power Electronics Co.,Ltd.,Changzhou 213025,China;NR Electric Co.,Ltd.,Nanjing 211102,China)

机构地区：[1]常州博瑞电力自动化设备有限公司,江苏常州213025 [2]南京南瑞继保电气有限公司,南京211102

出　　处：《机械工程师》2023年第1期92-94,共3页Mechanical Engineer

摘　　要：硅堆压装结构需要为半导体器件提供良好的机械和电气连接。文中分析一起半导体器件压接力发生偏移的原因,优化了一种硅堆球面压装结构。在此基础上,分别从硅堆结构强度仿真、压接力分布试验和整体电气性能测试三个方面,验证了优化后的球面压装结构的可靠性。通过显微观察器件失效形式并试验对比优化前后的两种硅堆结构,结果表明采用曲率更大的球面结构,硅堆在器件压接力均布性上更具优势,硅堆组件的可靠性也更高。Silicon stack press-fit structures need to provide good mechanical and electrical connections for semiconductor devices.This paper analyzes the reasons for the deviation of the pressing force of a semiconductor device,and optimizes a silicon stack spherical pressing structure.On this basis,the reliability of the optimized spherical press-fit structure is verified from three aspects,namely,silicon stack structure strength simulation,press-fit force distribution test and overall electrical performance test.Through microscopic observation of device failure modes and test comparison of the two silicon stack structures before and after optimization,the results show that by adopting a spherical structure with greater curvature,the silicon stack has more advantages in the uniformity of component press-fit force,and the reliability of the silicon stack assembly is also improved.

关 键 词：硅堆组件 球面压装 压力均布性 硅堆可靠性 

分 类 号：TN304.12[电子电信—物理电子学]