医用钴铬合金化学镀银工艺及其抗菌性能  

Electroless silver plating on medical Co–Cr alloy and antibacterial property of the coating

作　　者：徐向鹏 蔡艳青 苗雨行 张思雨 陈兴刚 许莹 XU Xiangpeng;CAI Yanqing;MIAO Yuhang;ZHANG Siyu;CHEN Xinggang;XU Ying(College of Materials Science and Engineering,North China University of Science and Technology,Tangshan 063021,China)

机构地区：[1]华北理工大学材料科学与工程学院,河北唐山063210

出　　处：《电镀与涂饰》2023年第1期7-12,共6页Electroplating & Finishing

基　　金：国家级大学生创新创业计划项目(X2021028)。

摘　　要：钴铬合金具有良好的力学性能和生物相容性,被广泛用作医用金属植入物,但钴铬合金的抗菌性能较差,容易引发细菌感染。为此,在钴铬合金表面化学镀银以提高其抗菌性能。研究了AgNO3质量浓度、温度和pH对化学镀银层厚度的影响。结果表明,随AgNO3质量浓度、温度或pH增大,Ag镀层厚度先增大后减小。较佳的配方和工艺条件为:AgNO35 g/L,NaOH 2.5 g/L,NH3·H2O 20 mL/L,葡萄糖0.45 g/L,酒石酸钾钠1.25 g/L,硫脲2 mg/L,pH 12.6,温度25℃,时间2 h。在该条件下制备的Ag镀层厚度为6μm,均匀、致密,无杂质,结合力达到12 N,具有良好的抗菌性能。Co–Cr alloy is widely used for medical metal implants due to its excellent mechanical properties and biocompatibility. However, bacterial infection is easy to happen for its poor antibacterial performance. Electroless silver plating was conducted on the surface of Co–Cr alloy to improve its antibacterial performance. The effects of several factors i.e. mass concentration of AgNO3, temperature, and pH on the thickness of Ag coating were studied. The results showed that the thickness of Ag coating was increased initially and then decreased with the increasing of mass concentration of AgNO3, temperature or pH. The bath composition and process conditions were optimized as follows: AgNO35 g/L, NaOH 2.5 g/L, NH3·H2O 20 mL/L, glucose 0.45 g/L, sodium potassium tartrate 1.25 g/L, thiourea 2 mg/L, pH 12.6, temperature 25 ℃, and time 2 h. The Ag coating obtained under the optimal conditions was 6 μm-thick, uniform, compact, and impurity-free with an adhesion force up to 12 N and excellent antibacterial property.

关 键 词：钴铬合金 化学镀银 抗菌性能 微观结构 结合力 

分 类 号：TQ153.16[化学工程—电化学工业]