Sn复合Ag@Cu低温固化导电浆料的制备与性能研究  

Preparation and properties of Sn-Ag@Cu low temperature curing conductive composite paste

作　　者：束长青 姚正军[1,2] 杜文博 龙漫[1,2] 张莎莎 SHU Changqing;YAO Zhengjun;DU Wenbo;LONG Man;ZHANG Shasha(College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;Key Laboratory of Materials Preparation and Protection for Harsh Environment,Ministry of Industry and Information Technology,Nanjing 210016,China)

机构地区：[1]南京航空航天大学材料科学与技术学院,江苏南京210016 [2]工业和信息化部面向苛刻环境的材料制备与防护技术重点实验室,江苏南京210016

出　　处：《电子元件与材料》2022年第12期1301-1306,共6页Electronic Components And Materials

摘　　要：通过添加低熔点金属Sn增加渗流通路和粉末间的结合性,提高Ag@Cu低温固化导电浆料的导电性能和力学性能。采用XRD、SEM、EDS、CLSM进行物相和微观形貌表征,探讨了浆料的导电和断裂机制。结果表明,适量Sn充当粉末间“桥梁”,促进浆料固化收缩。添加30%(质量分数)Sn时浆料体积电阻率最低为2.43724×10^(-4)Ω·cm。添加15%(质量分数)Sn时浆料固化后的弯曲强度可达46.69 MPa,Sn过量则会聚集形成大颗粒与孔洞,恶化力学性能。To improve the electrical conductivity and mechanical properties of Ag@Cu low temperature curing conductive paste,low melting point metal Sn was added to the paste to increase the seepage path and improve the bonding between powders.XRD,SEM,EDS and CLSM were used to characterize the phase and microstructure of the paste.The mechanism of conductivity and fracture was discussed.Results show that Sn acts as"bridges"between powders to promote solidification and shrinkage of slurry.Lowest resistivity is achieved at 2.43724×10^(-4)Ω·cm at 30%Sn(mass fraction).Bending strength of the paste with 15%Sn(mass fraction)can reach 46.69 MPa after curing.However,excessive Sn aggregates to form large particles and holes,which will deteriorate its mechanical properties.

关 键 词：低温固化导电浆料 力学性能 导电性能 低熔点金属 银包铜粉 

分 类 号：TB34[一般工业技术—材料科学与工程] TN604[电子电信—电路与系统]