TA1钛板表面凹坑激光熔覆修复后的电学性能和镀铜效果研究  

Study on Electrical Properties and Copper Plating Effect of TA1 Titanium Plate Surface Pits Repaired by Laser Cladding

作　　者：曾延琦 张林伟[1] 曾卫军[1] 王佳伟[1,2] 邱伊健 ZENG Yanqi;ZHANG Linwei;ZENG Weijun;WANG Jiawei;QIU Yijian(Institute of Applied Physics,Jiangxi Academy of Sciences,Nanchang 330096,China;Jiangxi Key Laboratory of Advanced Copper and Tungsten Materials,Jiangxi Academy of Sciences,Nanchang 330096,China)

机构地区：[1]江西省科学院应用物理研究所,江西南昌330096 [2]江西省科学院江西省铜钨新材料重点实验室,江西南昌330096

出　　处：《热加工工艺》2022年第23期124-126,130,共4页Hot Working Technology

基　　金：江西省科学院重点科研开发项目(2020-YZD-07);江西省科学院科研开发专项基金博士项目(2020-YYB-13);江西省科学院重大科研开发专项(2020-YZD-2);江西省重点研发计划项目(20202BBEL53022);江西省重大科技研发专项(20212AAE01003)。

摘　　要：采用涡流导电仪、扫描电子显微镜(SEM)和模拟实际生产工况的高电流密度镀铜试验,研究了TA1钛板表面凹坑激光熔覆修复后的电学性能、镀铜铜箔外观质量和微观形貌。结果表明:TA1钛板凹坑缺陷采用激光熔覆工艺修复后,熔覆区、熔合区、热影响区与基材区的导电率略有差异,平均差异均在5%以内,但是各区域镀的铜箔外观质量和微观形貌几乎无差异。采用激光熔覆技术对阴极钛辊表面凹坑等缺陷进行修复,有望实现钛辊的绿色修复再制造。The electrical properties of TA1 titanium plate after laser cladding pits, the surface and microstructure of the plated Cu foil were studied by eddy current conductivity meter, scanning electron microscope(SEM) and high current density copper plating test under simulated actual production conditions. The results show that when the pit defect of TA1titanium plate is repaired by the laser cladding process, the conductivity between cladding area, fusion area, heat affected area and substrate area is slightly different, with an average difference of less than 5%, but the appearance and micromorphology of the copper foil plated on each area are almost the same. Laser cladding technology is used to repair the defects such as the surface pit of the cathode titanium roller, which is expected to realize green repair and remanufacturing of the titanium roller.

关 键 词：TA1钛 凹坑 激光熔覆 导电率 铜箔 

分 类 号：TG456.7[金属学及工艺—焊接]