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作 者:万录明 王云 WAN Luming;WANG Yun(China Electronic Technology Group Corporation No.10 Research Institute,Chengdu 610036,Sichuan China)
机构地区:[1]中国电子科技集团公司第十研究所,四川成都610036
出 处:《粘接》2023年第1期1-5,共5页Adhesion
摘 要:现代电子设备热流密度剧增,迫使采用液冷板进行散热;液冷板制造缺陷导致液冷板渗漏。主要介绍液冷板的结构及工艺特点、渗漏缺陷产生原因、修复所使用厌氧胶的选择及性能,阐述了液冷板修复工艺过程以及修复后的实验验证,达到了液冷板渗漏缺陷用厌氧胶修复目的。结果表明,在2.5 MPa的气密耐压检测下,保压30 min无泄漏;液冷板渗漏厌氧胶修复成本低、修复周期短、简单易行。The rapid increase in heat flux in modern electronic devices has forced the use of liquid-cooled plates for heat dissipation.Liquid cooling plate leakage is caused by manufacturing defects.This paper mainly introduces the structure and process characteristics of the liquid cooling plate,the selection and performance of the anaerobic glue used in repair,and the repair process and the experimental verification after repair,so as to achieve the purpose of repairing the leakage defects of the liquid-cooled plate.The experimental results showed that there was no leakage under 2.5 MPa air tight pressure test for 30 min.The repair cost of anaerobic adhesive for leakage of cold plate is low,the repair period is short,and it is simple and easy.
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