基于机器视觉的SMB全自动锡膏印刷技术研究  

Research on SMB Full-automatic Solder Paste Printing Technology Based on Machine Vision

作　　者：李海玉[1] LI Hai-yu(Weifang Vocational College,Weifang 261000,China)

机构地区：[1]潍坊职业学院,潍坊261000

出　　处：《价值工程》2023年第3期125-127,共3页Value Engineering

摘　　要：本文从实际应用出发,针对锡膏印刷过程中出现的印刷缺陷进行分析,重点是对细间距器件的印刷缺陷进行分析研究,并分析印刷生产流程中容易产生的问题,通过改进印刷机钢网调整结构和视觉模块的软硬件设计以及调试印刷参数,提高印刷精度,减小印刷缺陷,提高印刷品质和生产效率,从而提升SMB产品品质,提高产品直通率,降低维修成本,提高企业的竞争力,为企业创造更多的经济价值,具有良好的市场前景。Based on the practical application,this paper analyzes the printing defects in Solder paste’s printing process,focusing on the printing defects of fine-pitch devices,and the problems that may arise in the printing process,through improving the design of hardware and software of adjusting structure and visual module of Printing Machine,and adjusting printing parameters,the printing precision is improved,the printing defects are reduced,the printing quality and production efficiency are improved,thus the SMB product quality is improved,it has a good market prospect to improve the product through rate,reduce the maintenance cost,improve the competitiveness of the enterprise and create more economic value for the enterprise.

关 键 词：机器视觉 锡膏印刷 印刷参数 

分 类 号：TN605[电子电信—电路与系统]