Uncover the mystery of interfacial interactions in immiscible composites by spectroscopic microscopy:A case study with W-Cu  

作　　者：Zhi Zhao Fawei Tang Chao Hou Xintao Huang Xiaoyan Song 

机构地区：[1]Faculty of Materials and Manufacturing,Key Laboratory of Advanced Functional Materials,Education Ministry of China,Beijing University of Technology,Beijing 100124,China

出　　处：《Journal of Materials Science & Technology》2022年第31期106-115,共10页材料科学技术（英文版）

基　　金：National Natural Science Foundation of China(No.52101032)to provide support for this work.F.T thanks the support from Beijing Natural Science Foun-dation(No.2214067).X.S.thanks the support from the National Natural Science Foundation of China(Nos.92163107,51621003).

摘　　要：Characterizing immiscible metallic composites with electron microscopy and X-ray spectroscopy is the classic way of obtaining their structural and physical details.Nevertheless,such a combination lacks abil-ity to tell the interfacial interactions at grain boundaries.Here we demonstrate a novel strategy to un-cover the mystery of interfacial interactions in such systems by spectroscopic microscopy.The morpho-logical and spectral data of samples were simultaneously recorded and analyzed,which reveals critical information regarding interfacial electronic modes.Taking W-Cu as a model,we experimentally quanti-fied its connectivity and unambiguously identified conditional bonding between W and Cu.Further,we chemically reconstructed the specific W-Cu boundary that possessed the strongest interactions and inves-tigated its atomic structure.The mechanism of W-Cu bonding was proposed and verified by first-principle calculations.The above methodology holds great promise to serve as a universal approach in achieving in-depth understanding of immiscible composites.

关 键 词：Metal-matrix composites Interface Physical properties Spectroscopic microscopy Interfacial bonding 

分 类 号：TB331[一般工业技术—材料科学与工程]