大面积处理芯片嵌入式微流体冷却技术  

Embedded microfluidic cooling technology for large-area processing chips

作　　者：杨宇驰 吕佩珏 杜建宇 李沫潼 杨宇东 潘鹏辉[3] 郑德印 张驰[1] 吴道伟 王玮[1] YANG Yuchi;LYU Peijue;DU Jianyu;LI Motong;YANG Yudong;PAN Penghui;ZHENG Deyin;ZHANG Chi;WU Daowei;WANG Wei(College of Integrated Circuit,Peking University,Beijing 100871,China;Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China;Xi’an Microelectronics Technology Institute,Xi’an 710054,China)

机构地区：[1]北京大学集成电路学院,北京100871 [2]清华大学航天航空学院,北京100084 [3]西安微电子技术研究所,陕西西安710054

出　　处：《微电子学与计算机》2023年第1期105-123,共19页Microelectronics & Computer

摘　　要：随着集成电胳制程趋于极限,登纳德缩放定律逐步失效,芯片的功率密度逐渐提升,尤其是在5G、物联网以及高性能计算快速发展的驱动下,单芯片面积也在增大,热耗散问题日趋严重,传统的冷却方式已无法保证芯片的可靠工作.将热沉制备在芯片内部可以避免封装材料的导热热阻和多层界面热阻,提升冷却性能和冷却效率.学术界针对芯片的嵌入式微流体冷却开展了大量卓有成效的研究和探索,不断提出新型通道结构设计方案,包括平行长直通道、歧管通道、射流通道等.旨在于优化泵功和热阻,在小压降下实现高效冷却.然而,随着芯片面积的增大,在限域空间实现高效冷却将更加困难,工艺难度和制造成本限制了嵌入式液冷的大规模商业化使用,目前在实际IC芯片内演示的冷却方案验证了嵌入式冷却的性能,但复杂度高,兼容性差,冷却性能有待进一步提升.尤其是在3D封装架构下,需要提出兼容小型化、高密度封装的通道结构,通过协同设计,在保证电学互连的前提下实现层间冷却.在优化通道结构设计的同时,还需要简化工艺,降低成本,提升嵌入式微流体冷却的工艺可靠性和长期工作可靠性,才能推进嵌入式微流体冷却技术的实际应用.As the integrated circuit process reaches the limit,Dennard's scaling law gradually fails,and the power density of the chip continues to grow.Especially driven by the rapid development of 5G,the Internet of Things and high-performance computing,the single-chip area is increasing rapidly,and the thermal dissipation problem is becoming more serious.The traditional cooling method cannot guarantee the reliability of chip operation.Embedded cooling can avoid the thermal resistance of the packaging material and the multilayer interface,which can also improve the cooling performance and efficiency.Much fruitful research and exploration have been carried out in academia on embedded microfluidic cooling of chips.New channel structure design solutions are constantly proposed,such as parallel long straight channels,manifold channels,jet channels,etc.It is designed to optimize pump power and thermal resistance for efficient cooling at small pressure drops.However,with the increased chip size,achieving efficient cooling in the restricted space will be more difficult.The process difficulty and manufacturing cost limit the large-scale commercial use of embedded liquid cooling.

关 键 词：嵌入式液冷 微流体冷却 大面积芯片 嵌入式冷却可靠性 

分 类 号：TP302[自动化与计算机技术—计算机系统结构] TN406[自动化与计算机技术—计算机科学与技术]