水基载体对铜复合浆料性能的影响  

Effect of water-based carrier on the properties of copper composite pastes

作　　者：田港旗 屈银虎 张学硕 王钰凡 高浩斐 张红 曹天宇 马敏静 TIAN Gangqi;QU Yinhu;ZHANG Xueshuo;WANG Yufan;GAO Haofei;ZHANG Hong;CAO Tianyu;MA Minjing(School of Materials Science and Engineering,Xi’an Polytechnic University,Xi’an 710048,China)

机构地区：[1]西安工程大学材料工程学院,陕西西安710048

出　　处：《西安工程大学学报》2022年第6期69-76,共8页Journal of Xi’an Polytechnic University

基　　金：陕西省重点研发计划项目(2020GY275);西安市科技计划项目(2017074CG/RC037(XAGC002));西安工程大学研究生创新基金(chx2021039)。

摘　　要：为了提高铜复合浆料流变性、表面张力和导热性,改善印刷性能和导电性,采用去离子水代替传统浆料中的有机溶剂,添加少量助剂来改善载液的流变性能,通过正交试验设计水基浆料配方,考察助剂对水基铜复合浆料性能的影响。采用JSM-6700F场发射扫描电子显微镜、X射线衍射仪及FT-340四探针电阻率测试仪等对铜复合浆料进行微观形貌观察和性能测试。结果表明;水基载体最佳配比为PEG-400∶黄原胶∶吐温-80∶去离子水=1.5∶0.5∶1.0∶97.0时,膜层致密化,导电网络完整,导电性及微观形貌极佳,铜复合浆料电阻率低至2.13×10^(-5)Ω·m。水基载体提高了铜复合浆料的印刷性能和导电性。In order to improve the rheology, surface tension, density, volatility and thermal conductivity of copper composite pastes, and thus the printing performance and conductivity, the effect of water-based carrier on the properties of the pastes was studied. Deionized water was used to replace the organic solvent in the traditional slurry and a small amount of additives were added to improve the rheological properties of the carrier liquid. The formulation of the water-based paste was designed by orthogonal experiment to investigate the effect of the additives on the properties of the water-based copper composite pastes. The micro morphology and properties of copper the pastes were observed by JSM-6700F field emission scanning electron microscope(SEM), X-ray diffraction analyzer(XRD) and FT-340 four probe resistivity testers. The results show that when the optimum ratio of water-based carrier was PEG-400∶Xanthan gum∶Tween-80∶Deionized water =1.5∶0.5∶1.0∶97.0, the film is dense, the conductive network is complete, showing excellent conductivity and micro morphology;and the resistivity is as low as 2.13×10^(-5)Ω·m. The water-based carrier greatly improves the printing performance and conductivity of the copper composite pastes.

关 键 词：水基铜复合浆料 水基载体 助剂 印刷性能 导电性 

分 类 号：TG156.8[金属学及工艺—热处理]