用于3D打印喷头的温控集成电路架构与设计  

Architecture and design of temperature controller ASIC applicable to 3D printers

作　　者：谢元禄[1] 张坤[1,2] 霍长兴 刘璟[1] XIE Yuanlu;ZHANG Kun;HUO Changxing;LIU Jing(Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China;University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院微电子研究所,北京100029 [2]中国科学院大学,北京100049

出　　处：《太赫兹科学与电子信息学报》2023年第1期119-124,共6页Journal of Terahertz Science and Electronic Information Technology

基　　金：国家重点研发计划基金资助项目(2017YFB1102900)。

摘　　要：3D打印技术作为新兴的增材制造技术领域的重要技术装备,正在向各领域拓展其应用范围。在3D打印机的工作过程中,需要对打印材料进行温度控制,以确保打印质量和打印效果。对于微滴喷射式的阵列打印头的研发而言,考虑到其体积、功耗等边界的严格约束条件,传统的可编程阵列逻辑(FPGA)、单片机等电路实现方案不再适用,需要开发与之配套的温控集成电路,并以裸硅片的形式与其他控制电路等进行集成封装。本文基于阵列打印头研发的边界条件限制,采用模块化集成电路设计方法,提出一种打印头温控集成电路架构,完成前端设计、原型验证、后端设计等开发工作。芯片版图面积740μm×740μm,符合设计需求,满足3D打印头的系统开发需要。As an important technical equipment in the emerging field of additive manufacturing technology,3D printer has been finding its way into more fields.In the working process of a 3D printer,the temperature control of the printing material ensures the printing quality and printing effect.For the development of a droplet jet array print head,considering the strict constraints in terms of device size,power consumption and other aspects,conventional methods with Field Programmable Gate Array(FPGA)or Microcontroller Unit(MCU)based architectures are no longer applicable,and the develoment of a temperature control Application-Specific Integrated Circuit(ASIC)becomes necessary,which will be included in an integrated package with other control circuits.Targeting the need of the development of an array print head,this paper proposes the architecture of a temperature control ASIC,and completes the front-end design,prototype verification,and backend design.The chip layout area is 740μm×740μm,which meets the design requirements and is applicable for use in the 3D printing head.

关 键 词：3D打印机 温度控制 集成电路 架构 

分 类 号：TN40[电子电信—微电子学与固体电子学]