SiBCN陶瓷和Ti_(2)AlNb合金瞬时液相扩散连接接头的微观组织和力学性能  

Microstructure and Mechanical Properties of SiBCN and Ti_(2)Al Nb Joint Prepared by Transient Liquid Phase Diffusion Bonding

作　　者：林金城 周佳峰 于迪[1] 林盼盼[1] 林铁松[1] 何鹏[1] LIN Jincheng;ZHOU Jiafeng;YU Di;LIN Panpan;LIN Tiesong;HE Peng(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]哈尔滨工业大学,先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《硅酸盐学报》2022年第12期3243-3250,共8页Journal of The Chinese Ceramic Society

基　　金：国家自然科学基金项目(51974101,51975150);国家磁约束核聚变能发展研究专项资助(2019YFE03100100);黑龙江省自然科学基金(JQ2020E003);云南省重大科技专项“云南省稀贵金属材料基因工程(一期2020)-贵金属材料专业数据库建设及应用示范(Ⅰ期)”(202002AB080001-1);中国-乌克兰材料连接与先进制造“一带一路”联合实验室建设与联合研究(2020YFE0205304)。

摘　　要：采用AgCu钎料瞬时液相扩散连接SiBCN陶瓷和Ti_(2)AlNb合金,研究连接温度和时间对接头微观组织和力学性能的影响。结果表明:连接过程中,Ti_(2)AlNb合金中的Ti元素向AgCu液相中溶解并与SiBCN陶瓷反应产生TiC界面反应层;液相中的Cu元素则向Ti_(2)AlNb中扩散形成Nb(s,s)和TiCu_(2)Al,使得液相发生等温凝固。随着温度升高或保温时间的延长,TiC层厚度增加,Cu(s,s)消失而TiCu_(2)Al化合物含量增加,接头室温抗剪强度呈现先上升、后下降趋势。在840℃保温40 min时所获接头在室温和500℃时抗剪强度分别达到(73±10)MPa和(95±16)MPa,这得益于Ag(s,s)良好的耐热性和应力缓解效果。A joint of SiCBN ceramic and Ti_(2)AlNB alloy was prepared via transient liquid phase diffusion bonding with AgCu fillers.The effects of joining temperature and holding time on the microstructure and mechanical properties of the joint were investigated.In joining,Ti dissolves from Ti_(2)AlNb alloy into Ag—Cu melt and reacts with SiBCN ceramic to form a continuous TiC interfacial layer,while Cu in the liquid phase diffuses towards Ti_(2)AlNb alloy to produce Nb(s,s)and TiCu_(2)Al,resulting in the isothermal solidification of melts.A thicken TiC layer appears,Cu(s,s)vanishes and the fraction of TiCu_(2)Al compound increases as the joining temperature or holding time increases.The shear strength at room temperature firstly increases and then decreases as the joining temperature or holding time increases.The joint prepared at 840℃for 40.min exhibits a maximum shear strength of(73±10)MPa and(95±16)MPa at room temperature and 500℃,respectively,which is mainly attributed to the good stress-relief ability and thermal resistance of Ag(s,s).

关 键 词：硅-硼-碳-氮陶瓷 银铜钎料 瞬时液相扩散连接 微观组织 力学性能 

分 类 号：TG454[金属学及工艺—焊接]